常壓電漿處理3D列印PLA材料以提升機械性質之研究｜國立臺灣科技大學博碩士論文系統

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研究生：	陳冠穎 Guan-Ying Chen
論文名稱：	常壓電漿處理3D列印PLA材料以提升機械性質之研究 Study on the improved mechanical properties of 3D printed PLA materials by Atmospheric Pressure Plasma
指導教授：	郭俞麟 Yu-Lin Kuo
口試委員:	魏大欽 Da-Qin Wei 廖淑娟 Shu-Juan Liao 王朝正 Chaur-Jeng Wang
學位類別：	碩士 Master
系所名稱：	工程學院 - 機械工程系 Department of Mechanical Engineering
論文出版年：	2022
畢業學年度：	110
語文別：	中文
論文頁數：	115
中文關鍵詞：	常壓電漿技術、3D列印、PLA材料
外文關鍵詞：	Atmospheric Pressure Plasma Jet, 3D Printing, PLA material
相關次數：	點閱：405 下載：0
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目錄
第一章 緒論.............................................................................................................................. 1
1 前言....................................................................................................................... 1
2 3D 列印的應用...................................................................................................... 3
3 研究動機............................................................................................................... 4
第二章 文獻回顧...................................................................................................................... 5
1 3D 列印.................................................................................................................. 5
1.1 3D 列印起源................................................................................................ 6
1.2 常見的 3D 列印製程................................................................................... 7
1.2.1 光固化製程(Stereolithography, SLA)............................................. 9
1.2.2 雷射粉末燒結(Selective Laser Sintering, SLS) ............................. 9
1.2.3 三維印刷成型(3D Printing and Gluing, 3DPG)........................... 11
1.2.4 材料噴塗成型(Material Jetting, MJ)............................................ 12
1.2.5 疊層製造成型(Laminated Object Manufacturing, LOM)............ 13
1.2.6 熔融層積成型(Fused Deposition Modelling, FDM).................... 14
1.2.7 指向性能量沉積技術(Directed Energy Deposition, DED) ......... 14
2 FDM 積層製造.................................................................................................... 16
2.1 FDM 的應用.............................................................................................. 17
2.1.1 醫療器材 ....................................................................................... 17
VII
2.1.2 建築 ............................................................................................... 18
2.1.3 家用 ............................................................................................... 18
2.2 常見的 FDM 材料.................................................................................... 20
2.2.1 丙烯烴-丁二烯-苯乙烯共聚物..................................................... 20
2.2.2 聚碳酸酯(Polycarbonat, PC)......................................................... 20
2.2.3 丙烯腈-苯乙烯-丙烯酸酯聚合物................................................. 21
2.2.4 熱塑性聚氨酯彈性體(Thermoplastic Polyurethane, TPU).......... 21
3 PLA 材料製造 ..................................................................................................... 22
3.1 PLA 材料性質........................................................................................... 23
3.2 PLA 表面自由能....................................................................................... 23
3.3 PLA 機械性質........................................................................................... 25
3.4 PLA 材料改質........................................................................................... 26
3.4.1 非加熱處理 ................................................................................... 26
3.4.1.1 無氧列印 ....................................................................... 27
3.4.1.2 化學氣相處理 ............................................................... 28
3.4.1.3 複合塗層 ....................................................................... 30
3.4.2 加熱處理 ....................................................................................... 33
3.4.2.1 輻射加熱列印 ............................................................... 34
3.4.2.2 雷射加熱列印 ............................................................... 36
3.4.2.3 熱膨脹微球添加列印 ................................................... 38
VIII
3.4.3 常壓電漿處理 3D 列印製程 ....................................................... 40
4 常壓電漿............................................................................................................. 41
4.1 常壓電漿反應機制................................................................................... 41
4.2 常壓電漿系統分類與工作型態分類....................................................... 44
4.3 噴射式常壓電漿激發分類....................................................................... 48
4.4 電漿氣體效應........................................................................................... 51
4.5 常壓電漿於表面改質應用....................................................................... 52
5 表面接觸角介紹................................................................................................. 53
6 拉伸強度定義與介紹......................................................................................... 55
第三章 實驗設計與方法........................................................................................................ 56
1 實驗總覽............................................................................................................. 56
2 實驗設備............................................................................................................. 57
2.1 電漿設備................................................................................................... 57
2.2 3D 列印機設備.......................................................................................... 57
3 實驗製程............................................................................................................. 59
3.1 電漿親水化試片處理............................................................................... 59
3.2 電漿拉伸試片處理................................................................................... 59
4 檢測儀器............................................................................................................. 61
4.1 光學發射光譜儀(Optical Emission Spectroscopy, OES) ........................ 61
4.2 水滴接觸角量測儀(Water Contact Angle Meter, WCA)......................... 61
IX
4.3 熱電偶傳感器........................................................................................... 63
4.4 紅外線熱像測溫儀................................................................................... 63
4.5 萬能材料試驗機....................................................................................... 64
4.6 光學顯微鏡(Optical microscopy, OM) .................................................... 65
4.7 場發射掃描式電子顯微鏡....................................................................... 65
4.8 X 射線光電子能譜儀(X-ray photoelectron spectroscopy, XPS).............. 66
第四章 結果與討論................................................................................................................ 67
1 電漿設計過程..................................................................................................... 67
1.1 初代電漿概念設計................................................................................... 67
1.2 電漿概念設計過程................................................................................... 67
1.3 電漿設備與 3D 列印機之裝配................................................................ 69
1.4 以電暈放電方式概念之電漿設備過程................................................... 70
2 電漿物種檢測分析............................................................................................. 71
3 3D 列印電漿溫度測試........................................................................................ 72
4 經 3D 列印電漿處理後之親水性及表面自由能分析...................................... 74
5 經 3D 列印電漿噴塗後之 PLA 聚乳酸試片 XPS 測試................................... 77
6 經 3D 列印電漿處理 ASTM638 拉伸試片之拉伸試驗分析........................... 79
7 拉伸試片斷裂面 OM 分析 ................................................................................ 84
8 拉伸試片斷裂面 SEM 分析 .............................................................................. 86
9 電漿處理 3D 列印 PLA 聚乳酸材料流程機制 ................................................ 88
X
第五章 結論............................................................................................................................ 90
第六章 未來展望.................................................................................................................... 91
                                

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全文公開日期 2027/08/23 (校內網路)
全文公開日期 2027/08/23 (校外網路)
全文公開日期 2027/08/23 (國家圖書館：臺灣博碩士論文系統)

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