本研究是利用磁濺鍍方式將單層鉭(Tantalum)薄膜沉積於Corning 0211玻璃基板上。樣品製備完畢，隨後進行PSC應力分析儀分析試片曲率半徑，進而計算薄膜應力值；奈米壓痕試驗儀得到薄膜楊氏係數(Ef)及硬度(Hf)；奈米級歐傑電子能譜儀來分析原子縱深分佈。最後，利用穿透式電子顯微鏡(TEM)觀察薄膜cross-section與plane-view原子影像。
實驗結果顯示，楊氏膜數與硬度由薄膜厚度增加之後數值分別提升10 GPa與3 GPa。量測之應力中包含本質應力與熱應力，在常溫下鍍膜與加溫鍍膜後扣除掉熱應力後的溫度對於本質應力的影響，加溫後的應力皆比常溫時的應力低，在此發現有應力鬆弛(stress relieve)的現象。在厚度100 nm時，薄膜已成長完整下，以本質應力為材料內主要應力的分佈。短軸除以長軸比值小於1顯示長軸與短軸為非等向性成長關係。奈米歐傑電子能譜儀可以分析出各個元素在試片中縱深分佈圖中可以看到試片前百分之一(約10 nm)的部分氧原子的含量很高，隨著深入至試片內部，鉭元素含量增加，氧元素含量下降。TEM觀察到深色部分為條狀成長後之柱狀結構，而柱與柱之間灰白色的區域判斷應為柱狀間之間隙為晶界位置造成氧的進入主要原因。當薄膜厚度為50 nm，氬氣分壓為1.5x10-2 torr時可達到本質應力接近為零，此為本實驗最理想之參數。

In this research, single layer Tantalum thin film deposited onto Corning 0211 glass substrate. In this way, it can enhance reflection of the laser light. Right after sample sputter Ta film, it undergoes to PSC stress analyzed instrument to measure the curvature of the sample. UMIS (Ultra Micro Indentation System) instrument measured the film’s Young’s modulus (Ef) and hardness (Hf). Auger electron nanoscope analyzed the depth profile of periodic elements. Finally, TEM was used to observe the film’s cross-section and plane-view of the atomic image.

The result showed Young’s modulus and hardness increase by film thickness increment. The total stress generates from zero stress to positive stress when the film increase. Total stress includes thermal stress and intrinsic stress, the stress after annealing was lower than the room temperature deposited. It showed the stress relieve besides room temperature sample. The intrinsic stress initially exhibited compression stress when the film below 50nm thick. Once the film grew to 100nm thick, the intrinsic stress were the main stress in the film. It showed anisotropy relationship between longitudinal and transverse axes in all Ta sample by calculation. From nano auger depth profile, it showed the oxygen percentage higher than other place in 1% from film surface. TEM showed that Ta were columnar growth, the cause of oxygen went inside to film is probably the Facing Target technique, which made the greater spacing between each columnar structure. When the film thickness reaches to 50 nm, Ar pressure controls to 1.5x10-2 torr, it can see the intrinsic stress nearly to zero point. That is the best condition the experiment had.

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