複線式鑽石線鋸(Multi-Wire Diamond Wire Sawing, MW-DWS)在目前晶圓切片製程中最具發展性，其中固定式磨料線鋸以鑽石線材進行往復式加工製程，因高效率的特點，在半導體產業占有一席之地。本研究將三軸力量即時感測系統於複線式線鋸機台上，以即時監控製程中線網三軸切削力量變化情形，其中建立複線式線鋸製程力量分析模式，並對其擷取訊號進行希爾伯特-黃轉換(Hilbert Huang Transform, HHT)以及快速傅立葉轉換(Fast Fourier Transform, FFT)，分析出線網切削力特徵訊號，並對實驗後晶圓量測結果進行比對，探討線網切削力對於加工不同材料所造成的影響。研究中分別用加工後三維表面粗糙度、表面形貌及線痕以及材料移除率進行分析驗證並驗證製程參數對於加工成果影響，用以優化製程參數，在本研究的結果中表示，X軸向受線網往復參數影響使實際結果中單/多晶矽材料三維中心線平均粗糙度差異9%；環境振動直接影響Y軸力量，實際切片4H單晶碳化矽材料中，材料特性亦會造成影響，其表面形貌碳/矽面差異81%，Z軸向力量與線張力相關，在材料移除率估算上開啟搖擺模式可降低誤差至1%。未來可將本研究分析方式應用於產線機台監控亦可用於優化製程參數。

　　Multi-Wire Diamond wire Sawing (MW-DWS) has been the most popular process in wafer slicing process. The reciprocating cutting of MW-DWS is also one of the fixed abrasive machining processes. With high efficiency feature, it is critical in semiconductor wafer industry. However, the cutting force of reciprocating effects of wire web is still unclear. This study is to develop a 3-D force analysis model of MW-DWS process with setting a triaxial force sensing system to monitor the change of triaxial force of the diamond wire web. The Hilbert Huang Transform (HHT) and FFT have been used to analyze the cutting force signal, then compared with experimental results to investigate the wire saw forces effect on materials, including mono, poly silicon and single crystal silicon carbide wafer. Experiment results show that the surface roughness is affected significantly by reciprocating parameters setting. Sawing Mark can be improved by environment and cooling pipes setting. Material Removal Rate (MRR) is proportional with the wire web tension and feed rate. Future study can focus on industrial process monitor of parameters optimization.

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