由於環保意識興起，綠色材料近年來以飛快的速度發展，且Sn-Pb銲料因成分中的鉛對人體與環境有害，無鉛銲料逐漸取代傳統Sn-Pb銲料，複合銲料目前為此領域的研究主軸，通常以常見之無鉛銲料成分加入強化相。本研究以目前市面上常見的Sn-3.0Ag-0.5Cu無鉛銲料作為主要材料，添加平均粒徑6-12 m金屬Ge粉末以及0.5-1.7 m之Pd粉末，重量百分比0、0.5、1.0，與2.0 wt.%，均勻混合後測試其熱分析性質與潤濕性質，並且與Cu基材進行界面反應，計算銲料與Cu之反應時的活化能。
在SAC添加Ge與Cu界面反應中，界面處生成Cu6Sn5與Cu3Sn相，銲料端析出Ag3Sn相，介金屬相隨著反應溫度的增加、反應時間的延長而增長；SAC添加Pd的界面反應中，於界面處生成Cu6Sn5與Cu3Sn相，銲料端析出Ag3Sn，添加量1.0與2.0 wt.%時銲料端有PdSn4相析出，介金屬相隨著反應溫度的增加、反應時間的延長而變厚。比較添加Ge與Pd的銲料抑制介金屬相成長的效果，添加Ge的效果較佳。在反應動力學的部分計算出SAC-xGe與銅反應之活化能大小為SAC/Cu<SAC-0.5Ge/Cu<SAC-1.0Ge/Cu<SAC-2.0Ge/Cu；添加Pd的銲料與銅反應之活化能大小為SAC/Cu<SAC-0.5Pd/Cu< SAC-1.0Pd/Cu< SAC-2.0Pd/Cu。
銲料經由熱分析測得液化溫度，添加Ge與Pd的銲料中皆以添加量為1.0 wt.%時得到最低溫，但整體而言液化溫度無明顯變化。潤濕性質方面，Ge的添加可使得銲料有較好的潤濕表現，潤濕時間較短，潤濕角較小；Pd的添加則使得銲料潤濕時間增加，潤濕角變大，相對而言潤濕表現較差。

The Pb element has been limited to use because the toxicity would make long-term influence to people health and environment. To replace the Sn-Pb solder alloy, numerous solder alloys have been developed. One of solder is Sn-3.0Ag-0.5Cu, which has been used for recent years. In order to improve the physical properties and the reliability of solder joint, some rare earth elements have been chose to dope into the solder. In this study, Germanium and Palladium elements are mixed with Sn-3.0Ag-0.5Cu solder paste into a uniform solder alloy. The physical properties such as thermal properties and wettability were taken with the solder alloy, and the interfacial reaction between solder alloy and Cu were investigated.
The interfacial reaction between SAC-xGe and Cu showed that there are Cu6Sn5 and Cu3Sn phases formed at the interface, and the Ag3Sn phase was found in the solder. The activation energy for reaction couples were caculated, and the comparison results is SAC/Cu<SAC-0.5Ge/Cu <SAC-1.0Ge/Cu<SAC-2.0Ge/Cu. Cu6Sn5 and Cu3Sn phases were also formed at the interface between SAC-xPd and Cu. In the solder, Ag3Sn formed in all reaction couples, while PdSn4 phase was found in the solder for the SAC-1.0Pd/Cu and SAC-2.0Pd/Cu reaction couples. The comparison of activation energy for Pd-composite solders is SAC/Cu<SAC-0.5Pd/Cu<SAC-1.0Pd/Cu< SAC-2.0Pd/Cu.
For the thermal properties, the composite solder with 1.0 wt.% addition have lower liquidus temperature, but the variation between different solder alloys are not really obvious. For the wettability, addition of Ge could decrease the wetting time and wetting angle; addition of Pd could increase the weting time and wetting angle.

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