本論文研究的目的為利用覆晶技術製作雷射陣列模組之封裝製程。此封裝模組由V槽、錫球、矽基板及單模透鏡光纖所組成。在V槽陣列的均勻度上，精度大部分都可以控制在正負1m以內。而在錫球方面，我們將有害的錫鉛合金換成錫銅合金，並大幅減少錫球的高度以改善高度不均勻的問題。本研究所需要的錫球高度約1.5m。
而透過覆晶封裝自動對準的優點，可以改善雷射封裝位置的準確性。根據表面張力，錫球可以將雷射自動控制在定義的區域，大大降低封裝時間。
在本研究中，八個雷射所組成的陣列在封裝完的耦光效率上表現最好的最高可以到達12％，最低有7.7％的效率。

We have packaged a laser array module using flip-chip bonding technique. This module is composed of V-groove, silicon bench, SnCu solder bump and lensed fiber.The precision can be controlled with 1μm with high-precision V-groove fabrication. We use lead-free solder and decrease the height of SnCu bump to ease the alignment between lasers and fibers.
The self-alignment mechanism of flip chip bonding can improve the precision and repeatability of laser coupling. The laser position can be controlled by the surface tension of SnCu bump. This scheme simplifies the packaging process 。
The packaged 8-channel laser arrays are measured to have a coupling ratio between 12% and 7.7％.

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