本研究是用多層板實現第5代行動通訊(5G)之毫米波天線，其工作頻段分別為24GHz到28GHz，以及37GHz到43.5GHz。進入5G後其工作頻率大幅提升，由於高頻率的電磁波在空氣傳播時，其路徑損耗較為嚴重。因此天線設計將採用陣列形式來提高增益，彌補路徑的損耗。為了減少傳輸線損耗與製程穩定度來提高良率，通過系統封裝(SiP, System-in-Package)與多層板疊構技術形成小尺寸且具穩定輻射特性之陣列天線封裝(Antenna-in-Package, AiP)。
本論文選擇了寬邊輻射(Broadside)的微帶天線(Microstrip antenna)為子天線，以4 x 4的規格設計陣列天線，增益可達到15dBi，並在多層的架構裡採用堆疊耦合的技術達到寬頻的效果，其頻寬足以覆蓋各個國家釋出的頻譜。
在用戶終端設備(Customer Premise Equipment)的應用中，本論文提出了以6 x 6天線陣列並且搭載射頻IC晶片，分別在28GHz、39GHz兩個頻帶可以達到高增益，以及寬角度的波束掃描效果。

This research used stacked multilayer dielectric substrates to realize the 5th generation of mobile communication (5G) millimeter wave antennas, and their work is divided into 24GHz to 28GHz, and 37GHz to 43.5GHz. After entering 5G, its operating frequency has been greatly increased. When high-frequency electromagnetic waves propagate through the air, its path loss is extremely serious.
Therefore, the antenna design will use an array to increase the gain and compensate for the path loss. To reduce transmission line loss and to improve process stability, a small-sized array antenna package (Antenna-in-Package) with stable radiation characteristics formed by system packaging (SiP, system-in-package) and multilayer board stacking technology AiP).
In this paper, the broadside radiating (Broadside) Microstrip Antenna was selected as the sub-antenna. The antenna was designed with a 4 x 4 specification, and the gain can reach 15dBi. In the multi-layer architecture, the technology of stacked patch is to achieve broadband. As a result, its bandwidth covers the spectrum released by all countries.
In the application of Customer Premise Equipment, this paper proposes a 6 x 6 antenna array, which added RFIC, which can achieve high gain and wide-angle multi-scanning effects at 28 GHz and 39 GHz, respectively.

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