本研究運用自動化檢測技術，整合晶粒取放模組、定位模組、視覺檢測模組、電性檢測模組以及等級分類模組成為完整的一套裸晶粒檢測設備。系統利用旋轉馬達搭配12組吸取裝置，攜帶晶粒至各檢測站，進行外觀與電性檢測，並將其結果用以等級分類。定位模組中先是利用圖形比對與二值化像素等影像處理技術估算待測晶粒面積，明確毀損之晶粒將不進行後續測試。視覺檢測模組採用利用物像空間映射關係，同步進行多面輪廓之取像。檢測方式是以無缺陷晶粒之影像特徵為標準，判定晶粒是否有瑕疵。至於電性檢測則採用四線式量測方式進行電路導通之測試。最後之等級分類站中，系統利用決策樹與之前測試結果，分別放置於四個等級對應托盤中。此外，本系統中亦對系統定位誤差設定校準步驟，以期提升系統運轉的可靠度。

An inspection and sorting equipment for known good bare dies has been developed in this study. The system developed consists of positioning module, pick-and-place module, vision inspection module, electrical inspection module and classification module. The operation of the system employs a rotary type mechanism with twelve suction heads to transport bare dies to four different stations, where appearance inspection, electrical inspection and product classification are performed. In the positioning module, an image processing subsoutine provides a rough estimation of the surface area of each individual die. The data can be used to discriminate broken dies from good dies. If a defect part is found, the information will be recorded and the die will not go through the rest of inspections. In the appearance inspection module, images of a bare die from five different views are examined and the passing criteria are established by golden samples. Regarding the electrical inspection, a four-wire measurement device is equipped to test theconductivity of integred circuits. In classification station, decision tree method is utilized to separate the qualities of dies into four grades and the dies with the same grade are stored in the same tray. In addition, an calibration procedure has also been developed to enhance the reliability of the system.

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