本研究為應用一可微調式之微射出壓縮技術，利用此技術成形複合式光學元件，並利用模穴內壓力感測裝置之壓力感測，搭配訊號擷取系統，以閉迴路方式控制微壓縮之動作，在微壓縮啟動機制上乃是利用模穴內壓力曲線之峰值壓力之百分比做為觸發控制，探討不同啟動時機點對複合式光學元件表面微結構轉寫率之影響。本研究並利用模流分析Moldflow MPI 5.0進行複合式光學元件之充填行為進行分析，並與射出成形之結果進行短射比對。在複合式光學元件製造部份本研究使用FANUC ROBOSHOT α15-ίA全電式射出成形機及Asahi Kasei 80NH PMMA塑料進行實驗，由實驗結果可得(1) 本研究成功利用壓力控制將複合式光學元件以微射出壓縮成形技術製造，(2) 在充填短射比對上，模流分析結果與實際射出充填結果相似，(3) 實驗結果顯示出在峰值壓力15%啟動微壓縮，可提高微結構轉寫率，其中在模具溫度90°C與融膠溫度250°C時，微結構轉寫率可達99%，(4) 在不同模仁材料比較上，STAVAX不鏽鋼電鍍無電解鎳，因硬度相較於無氧銅高，可以有較高的微結構轉寫率。本研究結果未來可應用於含有微結構之光學元件，以提高光學元件之光學性質。

This research conducted a novel micro injection compression molding (μ-ICM) process for fabrication of hybrid optical elements (HOEs). The micro compression motion is triggered by the percentage of peak filling pressure obtained by the data acquisition (DAQ) system. Experiments were implemented with different percentages of peak fill pressure, and the relationship between the trigger time and transfer ratio of the groove (TRG) were investigated. The Moldflow MPI software (Moldflow Co., USA) is used to simulate the filling and packing stages of HOEs. Comparison of short shot is preceded by simulation and experimentation. Results show that (1) the HOEs are fabricated successfully by the μ-ICM with a closed-loop pressure control, (2) the comparison of short shot is similar in simulation and experiment, (3) the TRG has been achieved as 99% when the trigger pressure is 15% of peak filling pressure with mold temperature 90°C and melt temperature 250°C, (4) the comparison of different mold insert materials show that the STAVAX with electroless plated Nickel (ELNi ) has better TRG than that of the oxygen-free copper (OFC) due to higher hardness of ELNi. Further research focuses on the μ-ICM of optical elements with micro structures to increase the optical performances.

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