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研究生： 許作宇
TSUO-YU HSU
論文名稱： 半導體封測製造業自動化設備與智能系統整合之初探
Preliminary Study on the Integration of Equipment Automation and Intelligent System in Semiconductor Packaging and Measurement Manufacturing Industry
指導教授： 王孔政
Kung-Jeng Wang
口試委員: 紀佳芬
Chia-Fen Chi
楊朝龍
Chao-Lung Yang
學位類別： 碩士
Master
系所名稱： 管理學院 - 管理研究所
Graduate Institute of Management
論文出版年： 2019
畢業學年度： 107
語文別： 中文
論文頁數： 56
中文關鍵詞： 自動化 、整合 、半導體 、樹莓派
外文關鍵詞： automation, integration, semiconductor, Raspberry Pi
相關次數： 點閱：612  下載：5 
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    • 積體電路的應用非常廣泛，如用於資訊，網通，消費電子， 醫療，汽車電子和國防等，台灣的半導體佔據了積體電路規模的 80%以上的市場。在 2015 年，台灣 IC 設計佔 74%，其餘為 9% 的類比晶片，9%的微元件和 8%的記憶體。 在智慧物聯網的創 新下，預計到 2025 年，整體產值將達到新台幣 4 兆元。近幾年 IoT 崛起，許多的應用搭著 IoT 的風潮推出，本研究針對半導 體封測業如何利用 IoT 來整合，將 Fab 建構為智能製造的生 產作業環境，進行探討。本研究對 8 吋晶圓級封裝廠，採用行動 研究法針對研究主題提供明確的定義與說明，作為研究架構分析 的基礎。依需求將智能製造分為自動化設備整合、系統整合兩部 分，在自動化設備整合再區分為支援標準自動化及不支援標準自 動化兩類別，利用 IoT 做自動化整合，讓設備在自動化作業上與 支援標準自動化的設備並無任何差異。系統與設備之間利用網際 網路做為通訊，提升資料的正確性、即時性、有用性、比較性、 相關性，以目前市面上容易於取得的裝置與設備整合，並遵循 SECS/GEM 標準自行開發機台自動化程式，並將生產自動化與相 關資訊化管理系統做整合，提出一智慧製造的模型。在往後發展 半導體廠的智慧製造時，可應用相同的概念進行系統的整合開發， 具有重複使用的價值。

    The application of integrated circuits is very extensive, such as information, Netcom, consumer electronics, medical, automotive electronics and national defense. Taiwan's semiconductors account for more than 80% of the integrated circuit scale. In 2015, Taiwan's logic IC design accounted for 74%, the rest was 9% analog wafers, 9% micro-components and 8% memory. Under the innovation of the Wisdom Internet of Things, it is estimated that by 2025, the overall output value will reach NT$4 trillion. In recent years, the rise of IoT, many applications launched with the wave of IoT, this study is aimed at how the semiconductor packaging and testing industry uses IoT to integrate, and the Fab is constructed as a production environment for intelligent manufacturing. This study provides a clear definition and description of the research topic for the 8 吋 wafer-level packaging plant using the action research method as the basis for the research architecture analysis. According to the demand, intelligent manufacturing is divided into two parts: automation equipment integration and system integration. In the integration of automation equipment, it is divided into two categories: support standard automation and standard automation. IoT is used for automation integration to automate equipment and support standards. There is no difference in the equipment. The system and the device use the
    II
    Internet as communication to improve the correctness, immediacy, usefulness, comparativeity and relevance of the data, and integrate the devices and devices that are easy to obtain on the market, and comply with the SECS/GEM standard. Self-developed machine automation program, and integrated production automation with related information management system to propose a smart manufacturing model. In the future development of the smart manufacturing of semiconductor factories, the same concept can be applied to the integrated development of the system, with the value of reuse.

    摘 要 ........................................................................................................................................................I A B S T R A C T .....................................................................................................................................II 誌 謝 .....................................................................................................................................................IV 目 錄 ...................................................................................................................................................... V 圖 目 錄 ............................................................................................................................................. VII 第一章 半導體封測與智能製造.................................................................................................................1 1.1 研究背景與動機 ..................................................................................................................................1 1.2 研究目的............................................................................................................................................4 1.3 研究方法與步驟..................................................................................................................................4 1.3.1 行動研究法......................................................................................................................................5 1.4 研究目的與結論.................................................................................................................................7 第二章 文獻探討......................................................................................................................................8 2.1 背景...................................................................................................................................................8 2.2 樹莓派................................................................................................................................................9 2.3 MES系統............................................................................................................................................10 2.3.1 MES定義..........................................................................................................................................10 2.3.2 MES的應用......................................................................................................................................11 2.4 SPC系統.............................................................................................................................................12 2.4.1 SPC的作用........................................................................................................................................13 2.4.2 SPC的優點.......................................................................................................................................14 2.5 泳道圖.................................................................................................................................................14 第三章 半導體封測產業自動化設備之整合....................................................................................................................................................17 3.1 SECS簡介.................................................................................................................................17 3.2 Non SECS (樹莓派自動化硬體控制整合)...............................................................................................................................................20 3.1.1分析階段.............................................................................................................................................22 3.1.2設計階段.............................................................................................................................................23 3.1.3建置階段.............................................................................................................................................23 3.1.4上線階段.............................................................................................................................................24 3.1.5 實際導入結果......................................................................................................................................25 3.1.6 流程說明.............................................................................................................................................30 3.3小結........................................................................................................................................................31 第四章 半導體封測產業之系統整合..............................................................................................................33 4.1 生產執照管理........................................................................................................................................33 4.2 離線監測...............................................................................................................................................34 4.4 生產配件管理........................................................................................................................................36 4.5 自動化設備與資訊系統整合...................................................................................................................38 4.6 小結.......................................................................................................................................................40 第五章 結論..................................................................................................................................................41 5.1 總結.......................................................................................................................................................41 5.2 管理意涵.................................................................................................................................................42 5.3 研究限制與後續研究建議.................................................................................................................................................43 參考文獻.....................................................................................................................................................45

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