高密度聚乙烯/銅錫合金無熔絲開關製備與性能研究｜國立臺灣科技大學博碩士論文系統

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研究生：	許博淳 PO-CHUN HSU
論文名稱：	高密度聚乙烯/銅錫合金無熔絲開關製備與性能研究 Fabrication and properties characterization of Cu一Sn Alloy/HDPE composites
指導教授：	葉正濤 Jen-Taut Yeh
口試委員:	陳幹男 none 黃繼遠 none 邱士軒 Shih-Hsuan Chiu 吳進三 none
學位類別：	碩士 Master
系所名稱：	工程學院 - 材料科學與工程系 Department of Materials Science and Engineering
論文出版年：	2010
畢業學年度：	98
語文別：	中文
論文頁數：	54
中文關鍵詞：	導電性高分子材料、高密度聚乙烯/銅錫合金複合材料
外文關鍵詞：	conductive polymer materials, high density polyethylene/Cu-Sn Alloy composite
相關次數：	點閱：242 下載：0
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本研究主要針對銅錫(CuSn)合金/高密度聚乙烯(PE)及改性銅錫(CuSn)合金/高密度聚乙烯(PE)的導電性能做了一系列探討。研究發現，相較於(CuSna/b)xPEy樣品，經異丙基三（二辛基焦磷醯氧基）鈦酸異丙酯(LICA38)改性之 (CuSna/bLc)xPEy樣品樣品的體積電阻率均明顯降低。而且，相較於混煉法，球磨法製備之 (CuSna/b)xPEy樣品的體積電阻率亦顯著降低。同時，球磨法製備之不同厚度(CuSna/b)xPEy樣品的體積電阻率隨著厚度的減小而明顯降低。為瞭解上述有趣的現象，本研究對純CuSn合金，經LICA38改性CuSn合金樣品的紅外光譜及表面形態，(CuSna/b)xPEy 和(CuSna/bLc)xPEy樣品的熱學性質和導電性能進行了探討。

In this experiment, the conductivity properties of high density polyethylene (HDPE) composites filled with (Cu-Sn ) Alloy and modified Cu-Sn Alloy (MCu-Sn ) which was modified with LICA38 . Investigates indicated that the Volume Resistivity of (CuSna/bLc)xPEy is lower than (CuSna/b)xPEy. In addition, Volume Resistivity of (CuSna/b)xPEy prepared by ball milling method decreased with thickness increa. The Fourier Infrared（FTIR），differential scanning calorimetry （DSC）and multiple function micro-electrical resistance meter (KEITHLEY2700) were used to study the surface morphology, thermal and electrical properties of (CuSna/b)xPEy and (CuSna/bLc)xPEy.

目   錄
論文摘要------------------------------------------------------------------Ⅰ
ABSTRACT----------------------------------------------------------------- Ⅱ
誌謝----------------------------------------------------------------------Ⅲ
目錄----------------------------------------------------------------------Ⅳ
圖表索引------------------------------------------------------------------Ⅶ
第一章 前言---------------------------------------------------------------1
第二章 文獻回顧-----------------------------------------------------------5
2.1 高分子導電複合材料----------------------------------------------------5
2.2 導電填充--------------------------------------------------------------6
2.3 高分子基材------------------------------------------------------------7
2.4 導電機制--------------------------------------------------------------8
2.5 滲透理論--------------------------------------------------------------9
2.6 接觸電阻及穿隧效應---------------------------------------------------13
2.6-1接觸電阻------------------------------------------------------------13
2.6-2量子穿隧效應--------------------------------------------------------15
2.7導電填充物研究史------------------------------------------------------17
2.8高分子複合材料的靜電現象----------------------------------------------23
第三章 實驗
3.1實驗藥品--------------------------------------------------------------25
3.2實驗步驟--------------------------------------------------------------26
3.2-1混煉法--------------------------------------------------------------27
3.2-2球磨法--------------------------------------------------------------27
3.3實驗流程-------------------------------------------------------------29
3.3-1銅錫合金表面改性實驗步驟--------------------------------------------29
3.3-2實驗流程一~二-------------------------------------------------------29
3.4傅立葉紅外光譜--------------------------------------------------------30
3.5電性測試--------------------------------------------------------------30
3.6合金填充物表面型態性質分析--------------------------------------------31
3.7合金填充物熱學性質分析------------------------------------------------32
3.7-1微差掃描熱分析儀 (DSC) ---------------------------------------------32
3.7-2熱機械分析儀 （TMA）------------------------------------------------33
第四章 結果與討論
4.1偶合劑，銅錫合金粉和改性銅錫合金粉樣品的紅
外光譜--------------------------------------------------------------33
4.2銅錫合金/高密度聚乙烯樣品形態分析-------------------------------------38
4.3 CuSn/PE樣品熱學性----------------------------------------------------42
4.4 CuSn/PE樣品導電性能--------------------------------------------------46
第五章 結論--------------------------------------------------------------51
參考文獻-----------------------------------------------------------------52

                                

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