目前市售之LED 路燈多為單晶封裝以陣列方式排列成一個面光源，而近年來隨著COB LED 興盛，在功率提高的同時散熱亦成為一個重要的問題，此時COB LED 必需安裝在合適的燈具上，且排列方式勢必要改變，否則會有熱源過度集中的問題，造成燈具模組可靠度及壽命降低。
本研究之目的為改善COB LED 之散熱問題。第一部分：在光源排列緊密的情況下，利用改變散熱鰭片的材質來討論散熱模組的溫度分佈情形及解熱能力。第二部分：使用市面上最常見之鋁擠型鰭片，針對不同的光源放置距離來討論燈具模組的散熱狀況，並於不同的光源距離下分別討論其對電性及光性質的影響，最再後討論路燈安裝傾角對散熱模組的影響。
本文利用Tracepro 光學模擬軟體及CFDesign 熱模擬軟體進行分析，並與實際量測散熱模組的溫度與光衰程度，其趨勢皆與模擬相同，間接證實了模擬的可信度。

Most of LED street lamps are arrayed by single chip LED to form a surface light on the lamp market. These days, with the luxuriant of COB LED, heat became an important problem while lamp power increased. In this case, COB LED has to be set on a proper lamp heat-sink, and the arrangement must to be change. Otherwise, heat problem may cause the lamp module unstable and lifetime decrease.
The goal of this study was to improve the heat problem of COB LED street lamp module. First, in the case of light engine arranging closely, altering the material of heat sink to discuss heat distribute and the ability of thermal management of different heat-sinks. And then, use the most common seem of aluminum extrusion type heat-sink and made different types of array distances between LED light engines to discuss the ability of thermal management of the lamp module. Analysis the influences of electrical property and illuminant performance caused by different light engine distances and of heat spreading by different setting angles base on one fixed array distance.
This study used the Tracepro optic simulation software and CFDesign heat simulation software. Then, measure the temperature and light decay practically. The measuring tendency is the same as the simulation. It verified the result of simulation.

[1]經濟部能源局，我國能源科技發展政策，我國能源發展政策目標，2008。
[2]經濟部能源局，我國能源發展綱領政策環境影響評估之檢討，中研院，2007。
[3]http：//www.ledinside.com.tw/
[4]D. A. Steigerwald, J. C. Bhat, D. Collins, R. M. Fletcher, M. O. Holcomb, M. J. Ludowise, Member, P. S. Martin, and S. L. Rudaz, “Illumination with Solid State Lighting Technology,” IEEE Journal on Selected Topics in Quantum Electronics, Vol. 8, pp. 310-320, 2002.
[5]黃忠偉，胡能忠,， “光學系統模擬設計”，五南圖書出版股份有限公司，2008。
[6]T. W. Paper, “Understanding power LED lifetime analysis”, PHILIPS, 2007.
[7]http:image.space.rakuten.co.jp/lg01/62/0000017462/36/imga710c61c67e43w.gif
[8]F. M. Mims, “Light Emitting Diodes” Howard W. Sams & Co., Inc., Indiana 46268, 1973.
[9]N. Narendran , and Y. Gu, “Life of LED-based white light sources”, Journal of Display Technology 1, 167-170, 2005.
[10]陳興，“白光發光二極體簡介”，工業技術研究院 工業材料研究所，工業材料，Vol.162，pp. 133-136，2000。
[11]陳凱琪、李巡天、許嘉紋、林志浩，“LED 元件用高效能透明封裝材料技術趨勢（上）”，工業材料雜誌246期。
 
[12]劉如熹、劉宇桓，“發光二極體用氧氮螢光粉介紹”，全華科技圖書股份有限公司出版，台北市，2006。
[13]林竹軒， “New Green Lighting – RGB White LED Lighting”, 光電特刊。
[14]游慧茹，“目前LED散熱基板的趨勢”，2009。
[15]http：//www.philips.com.tw/
[16]Y. Gu, N. Narendran and J.P. Freyssinier, “White LED performance”, Society of Photographic Instrumentation Engineers 5530, 119-124, 2004.
[17]R. F. Pierret, “Semiconductor device fundamentals”, Addison WesleyLongman, 1996.
[18]史光國，“半導體發光二極體及固體照明”，全華科技圖書股份有限公司，2005。
[19]http://en.wikipedia.org/wiki/Thermal_conductivity
[20]A. Christensen, M. Ha, and S. Graham, “Thermal management methods for compact high power LED arrays”, Proceedings of Society of Photographic Instrumentation Engineers 6669, 66690Z1-66690Z19, 2007.
[21]黃國長，“高亮度LED之熱模擬分析探討”，碩士學位論文,國立清華大學工程與系統科學系，2009。
[22]L. Yuan, S. Liu, M. Chen and X. Luo, “Thermal Analysis of High Power LED Array Packaging with Micro-channel Cooler”, IEEE, International Conference on Electronics Packaging Technology, 2006。
[23] Y. Gu, N. Narendran, and J. P. Freyssinier, “White LED performance”, Society of Photographic Instrumentation Engineers 5530, 119-124, 2004.
 
[24]G. J. Sheu, F. S. Hwu, J. C. Chen, J. K. Sheu, and W.C. Lai, “Effect of the Electrode Pattern on current spreading and driving voltage in a GaN/Sapphirem LED Chip”, Journal of The Electrochemical Society 155, H836-H840, 2008.
[25]鄭景太，“高功率LED封裝技術的發展現況”，工業材料雜誌266期刊，2009。
[26]許嘉紋、黃淑禛、陳凱琪，“LED元件構裝用高折射率透明封裝材料技術”，工業材料雜誌262期刊，2008。
[27]李巡天，“台灣高性能LED封裝材料技術發展介紹”，工業材料雜誌258期，2008。
[28]A. Christensen, and S. Graham, “Thermal effecting packaging high power light emitting diode arrays”, Applied Thermal Engineering 29, 364-371, 2009.