半導體晶圓廠是一個非常複雜的製造環境，其中包含250至300種製程機台，需執行幾百甚至有上千種不同製程步驟。在執行興建新的晶圓廠前需要做許多面向的考量，包含廠址選擇、設定製程目標、機台選定等，建廠時程的掌握及機台設備的選擇會影響到晶圓廠的廠務設施容量、廠房面積、興建成本、運轉時生產效率和產品成本。現階段一座十二吋晶圓廠的建置成本大約十八億美元，其中採購製程設備和安裝架設就佔約十五億美元；對於一座每月投產三萬片十二吋晶圓的晶圓廠，不包括製程設備或其它設施的運轉成本，每年生產的成本就需要約六至七億美元。就因半導體廠投資金額如此高，故如何有效地掌握十二吋晶圓廠興建時程及各相關環節的合作，就顯得非常重要了。本研究是以半導體微影製程角度來做論述，並藉以快速掌握新建廠房的關鍵規格，增加建廠效率及縮短建廠時程，使半導體廠商可以有效掌握產品推出時程及大幅降低投資成本。
本文將實際以台中科學園區某新廠為例，該廠自規劃、破土到第一片晶圓產出，以破紀錄約十四個月的時間即達到試產完成目標。本論文將針對該廠優異表現，以晶圓廠微影工程角度來探討自設計規劃、廠房土建、廠務設施容量規劃、專案執行、工安管理、機台配置規劃、機台搬入、二次配裝機、試產、及量產等過程，藉以瞭解掌握新建廠工程專案之關鍵成功要素，並以結果來檢視最初規劃時所訂定的規格。本研究是首度以微影工程使用者的角度來探討新建十二吋廠晶圓廠的過程及規格檢視，期望藉由建廠模式之建立，提供有效率地掌握高科技廠房建廠時程之準則，以符合市場需求並達成降低業者成本之目的。

A semiconductor wafer fab is a very sophisticated and complex manufacturing environment with between 250 to 300 types of processing tools to execute hundreds to thousands of process steps. Many decisions need to be made before constructing a new wafer fab, including site location, a technology road map, schedule control, and tool selection. Among them, schedule control and tool selection are the most critical factors, because they have major impact on facility design capacity, fab footprint, construction cost, running efficiency, and production cost. The most advanced wafer fab costs as much as US$1.8 billion. Of this amount, US$1.5 billion is for the purchasing of process equipment and installation fees. The average annual operation cost of a 12-inch wafer fab with a monthly output of 30,000 wafers is between US$ 600 to 700 million, excluding the cost of acquiring process equipment and other facility operation costs. Due to the huge investment necessary for setting up a semiconductor fab, it is crucial to control the schedule of the fab and the seamless cooperation among all the construction processes. Since semiconductor lithography is the most critical process to semiconductor manufacturing, this study investigates the fab construction process, from this point of view. By taking control of the key processes of a fab facility, we can increase fab setup efficiency and minimize construction time. Therefore, the time-to-market schedule of a semiconductor fab can be predicted, and the investment cost can be reduced immensely.
This case study used a newly set up fab located in Tai-Chung Scientific Park, which has set a record for the completion of planning, ground breaking, and first silicon yielding within 14 months. In this study, we will discuss the execution process of this successful fab construction based on fab module engineering aspects, including fab building construction, facility utilities capacity planning, project execution, industrial safety management, risk management, layout planning, tool move-in, hook up, pilot run, and production run. Since the proper execution of each step is critical to the subsequent steps, this study identifies the essential elements for the success of each step and also evaluates the fitness of the initial specifications based on the final performance. The study here is the first one to discuss the 12”Wafer FAB set up project and key SPEC review according to user aspect, which is Photolithography engineering. The results of this study can provide guidelines for starting future high-tech fab projects more efficiently to better meet future market demand and significantly reduce investment.

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