本文發展出準穩態分子靜力學奈米級正交切削模式，其除可計算切削力、等效應力與等效應變外，亦可計算被切削工件所提升之溫度；進而可進行被切削工件的溫度分佈分析。本文假設奈米級正交切削時被切削工件溫度的提升是由塑性變形熱與摩擦熱兩種熱源產生。本文之等效應力與等效應變的計算方法為使用三維準穩態奈米靜力學奈米切削模式模擬計算。本文應用力平衡之概念，並以Hooke-Jeeves搜尋法來求解力平衡方程式求出被切削工件每個原子新的位移位置，再推算出切削時切屑的形狀及切削力之大小。求出原子變形位移的位置之後，配合有限元素的形狀函數概念，來求得切削工件之等效應變，再配合的奈米級薄膜拉伸數值實驗之應力-應變曲線經回歸處理後所得之塑流應力-應變(flow stress – strain)關係式，利用塑流曲線來計算元素之等效應變下所產生之等效應力。本文所發展之塑性變形熱可由被切削工件之等效應力與等效應變計算出，進而發展由塑性變形熱產生的提升被切削工件溫度之計算方法。又本文另發展出刀面上的工件原子產生摩擦熱的方法及計算刀面上的工件原子的溫度提升之方法。其方法為將莫氏力分解成刀面上之摩擦力，再計算摩擦力做的功所產生的熱量。再將此熱量再分配給刀面上之工件原子及分配給刀具原子，進而計算刀面上的工件原子的溫度提升之數值。本文再將兩種熱源所產生之溫度提升加總計算後，得到被切削工件各原子提升之總溫度，再進行溫度場分析。此外本文亦進一步將前述所得被切削工件各原子提升之總溫度帶入有限差分熱傳方程式，進行熱量傳遞，亦即為將每一步階產生之總溫度數值帶入熱傳方程式計算所得之工件溫度即為下一步階之工件初始溫度，利用此方法計算出每一步階奈米級正交切削之被切削單晶矽工件溫度場，再進行分析。最後並與前述未考慮有限差分熱傳遞所計算的被切削工件各原子之溫度提升之數值做比較。

The quasi-steady molecular statics nanoscale orthogonal cutting model developed by the paper not only can calculate cutting force, equivalent stress and equivalent strain, but also can calculate the temperature rise of the cut workpiece, and can further analyze the temperature distribution of the cut workpiece. The paper supposes that during nanoscale orthogonal cutting, the temperature rise of the cut workpiece is produced by two heat sources, plastic deformation heat and friction heat. The calculation method of equivalent stress and equivalent strain is just the simulative calculation using three-dimensional quasi-steady nano-statics nanocutting model. The paper applies the concept of force balance, and uses Hooke-Jeeves direct search method to solve the force balance equation, and obtain the newly displaced position of each atom of the cut workpiece. After that, the paper calculates the shape of chip and size of cutting force during cutting. After the position of atomic deformation and displacement is acquired, it is matched with the shape function concept of finite element to obtain the equivalent strain of the cut workpiece. After the stress-strain curve of nanoscale thin film stretch numerical experiment has undergone regression treatment, the flow stress-strain relational equation is acquired. Plastic flow curve is used to calculate the equivalent stress produced by the equivalent strain of element. The plastic deformation heat developed by the paper can be calculated by the equivalent stress and equivalent strain of the cut workpiece. Furthermore, the calculation method of temperature rise of the cut workpiece produced by plastic deformation heat can be developed. In addition, the paper additionally develops a method for production of friction heat by the workpiece atoms on cutting tool and a calculation method of temperature rise of workpiece atoms on cutting tool. These methods are to decompose Morse force to be friction forces on cutting tool, and then calculate the heat produced by friction force. After that, such heat is distributed to the workpiece atoms on cutting tool, and distributed to the cutting tool atoms. Furthermore, the numerical value of temperature rise of the workpiece atoms on cutting tool is calculated. After the paper has calculated the sum of temperature rise produced by these two heat sources, the total temperature rise of each atom of the cut workpiece is obtained, and the temperature field is further analyzed. Besides, the paper further substitutes the total temperature rise of each atom of the cut workpiece obtained above, in the finite difference heat transfer equation, and carries out heat transfer. It refers that the workpiece temperature calculated by substituting the numerical value of total temperature produced in each step in the heat transfer equation, is just the initial temperature of workpiece in the next step. This method is used to calculate the temperature field of the cut single-crystal silicon workpiece of nanoscale orthogonal cutting in each step, and then analysis is also made. Finally, it is compared with the numerical value of temperature rise of each atom of the cut workpiece calculated by the finite difference heat transfer, which has not been considered above.

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