本研究旨在探討晶圓廠製造晶圓的背後，面對眾多高精密設備、精細生產配方、量測配方以及大量多元的資料收集、分析及判讀，這些工作已不再能依賴大量人力記憶生產規範及紀錄資訊，持續穩定地進行生產。特別是在發現晶圓異常時，往往已是眾多晶圓片等待判定報廢的情況。因此，仰賴電腦系統彼此協同作業，協助晶圓廠內各單位人員降低執行各種人工標準作業程序的種類與數量，已成為必然之舉。

然而，放眼望去，全球晶圓製造在新冠疫情發生後，才驚覺台灣晶圓製造有著獨到的技術方法。即使是以科技及工業能力自豪的美國、德國及日本，也是半導體設備的主要製造商，但他們國內擁有各類科學頂尖人才和軟硬體資源，卻仍爭相爭取台灣大廠在其國家設廠。他們無法突破奈米線寬與量產良率的障礙。

憑藉多年在台灣大廠從事電腦整合製造(CIM)自動化的經驗，本研究將以晶圓廠獨有的基礎生產應用系統進行研究，分析並歸納出晶圓廠基礎系統建置策略。這對晶圓廠內的生產單位、設備工程師以及製程工程師來說，提升良率、產能及線寬技術都是至關重要的，瞭解MES、EAP、RMS、SPC、FDC 等系統彼此之間與晶圓廠組織任務的關聯，以及對建構晶圓廠自動化應該採取的步驟以及在日後維護的策略，透過以SECS 通訊協議為基礎，連結半導體設備，收集資訊及控制設備、能夠快速發現問題、高效分析問題，並準確控制及解決問題。

關鍵字: 線寬、電腦整合製造(CIM)、製造執行系統(MES)、設備自動化程式(EAP)、配方管理系統(RMS)、統計製程控制(SPC)、故障檢测與分類系统(FDC)、半導體設備通訊標準(SECS)

This study aims to explore the intricacies behind the manufacturing of wafers in semiconductor factories, which involve numerous high-precision equipment, intricate production formulas, measurement formulas, and extensive data collection, analysis, and interpretation. These tasks can no longer rely solely on extensive human memory of production norms and record-keeping to ensure continuous and stable production. Particularly when wafer abnormalities are detected, it often occurs with numerous wafers awaiting assessment for scrapping. Therefore, relying on computer systems to collaborate and assist various units within the wafer factory in reducing manual standard operating procedures has become inevitable.

However, upon closer inspection, the global wafer manufacturing industry only truly recognized Taiwan's unique technological methods after the outbreak of the COVID-19 pandemic. Even countries like the United States, Germany, and Japan, known for their technological and industrial prowess and major semiconductor equipment manufacturers, are competing to attract major Taiwanese factories to establish plants in their countries. They struggle to overcome barriers such as nanometer linewidths and mass production yields.

Drawing on years of experience in computer-integrated manufacturing (CIM) automation at major Taiwanese factories, this study will focus on the unique foundational production application systems in wafer factories to analyze and summarize the strategies for building foundational systems in wafer factories. This is crucial for production units, equipment engineers, and process engineers within wafer factories as improving yields, capacity, and linewidth technology are paramount. Understanding the interrelationships between systems such as MES, EAP, RMS, SPC, FDC, and the organizational tasks of the wafer factory, as well as the steps to take in constructing wafer factory automation and strategies for maintenance in the future, is essential. Through linking semiconductor equipment via the SECS communication protocol, collecting information, controlling equipment, quickly identifying problems, efficiently analyzing issues, and accurately controlling and resolving them can be achieved.

Keywords: linewidth, Computer-Integrated Manufacturing (CIM), Manufacturing Execution System(MES), Equipment Automation Program (EAP), Recipe Management System(RMS), Statistical Process Control(SPC), Fault Detection Classification(FDC), SEMI Equipment Communications Standard(SECS)

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