散熱問題是影響晶片效能可否提升及系統穩定性的關鍵因素，而散熱器即扮演著加快晶片散熱速度的角色，本研究是針對氣冷式的電子散熱裝置，即散熱片與風扇的組合，以數值模擬配合田口分析，進行散熱片的熱傳性能分析。首先定義散熱片之設計參數，以一維解析方法計算散熱片的熱阻及壓降，評估所配置的參數是否符合本研究所設定的效能目標，接著使用熱傳分析軟體FLOTHERM進行散熱片效能模擬。此外本研究也實際製作樣品，利用實驗測量的結果來比對解析方法及數值模擬結果。
根據研究中配置的設計參數，在田口方法分析後得到影響散熱片熱阻程度大小的設計參數為：鰭片的數目>鰭片的厚度>鰭片的高度>底座厚度；影響散熱片壓降程度大小的設計參數為：鰭片厚度>鰭片數目>鰭片高度>底座厚度。
本研究的分析方法及結果，可提供設計者在進行散熱片的開發設計時，能以較低的實驗操作成本和較短的分析時間，得到最佳的散熱片設計參數組合。

The effectiveness of the heat-dissipation module is a critical factor which affects the reliability and the operation of an electronic device. This study employed the Taguchi method to find the optimal design parameters for the active air-chilled heat sink device. The heat transfer and fluid flow characteristics are studied using one-dimensional analytic thermal resistance network model, three-dimensional CFD model and experimental methods
The commercially available FLOTHERM software was chosen as the tool to make the CFD study. The comparison of the results shows satisfactory agreement between the results obtained by different study methods.
Fours different design parameters： the thickness of the base plate, the thickness of the fin, the height of the fin, and the total number of the fin, are chosen to study their effect on the heat sink thermal performance. It is found that the two most important factors that affect the pressure drop and thermal performance characteristics of the heat sink are the thickness of the fin and the total number of fins of the heat sink. Base on the Taguchi method, an optimal design of the heat sink is proposed and its performance is confirmed by the experimental measurement.

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