研究生: |
杜弘彬 Hong-bin Du |
---|---|
論文名稱: |
昇壓式功因修正器之傳導性電磁干擾高頻模型確認─模擬與實測 Confirmation of the High Frequency Model for Conducted EMI in Passive Components ─ Simulation and Measurements |
指導教授: |
陳南鳴
Nan-Ming Chen |
口試委員: |
呂錦山
Ching-Shan Leu 潘晴財 Ching-Tsai Pan |
學位類別: |
碩士 Master |
系所名稱: |
電資學院 - 電機工程系 Department of Electrical Engineering |
論文出版年: | 2009 |
畢業學年度: | 97 |
語文別: | 中文 |
論文頁數: | 74 |
中文關鍵詞: | 功因修正器 、電子電路 、高頻特性 、電磁干擾 |
外文關鍵詞: | Power Factor Corrector, Power Electronics, High-Frequency Characteristics, Electromagnetic Interference |
相關次數: | 點閱:326 下載:20 |
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本文目的在探討傳導性電磁干擾模型的一般化,選用的架構為昇壓式功因修正器電路,並參考文獻[1]之高頻模型的建立方式,來探討傳導性電磁干擾實測與模擬波形的吻合程度。本文的實驗步驟可分為兩大部分。第一部分為低頻分析,是為了完成昇壓式功因修正器之正常動作模擬。第二部份為高頻分析,考量傳導性電磁干擾的實際量測頻段為150 kHz ~ 30 MHz,將需考量的低頻元件加入高頻元件特性。
首先個別進行元件模擬與實測之阻抗與相位曲線吻合程度,再套用模型於電路中以完成傳導性電磁干擾之電路模擬架構,最後將模擬的雜訊與實際量測的雜訊做比較,以探討模型的應用範圍是否適用於傳導性電磁干擾的量測頻段。以事先預測電磁干擾問題,如此將可降低電路設計的時間與成本。
藉由文獻[1]高頻模型的套用結果,得知不同電路的電磁干擾將有不同的影響,其包含電路架構、元件特性、電路設計及PCB佈局等,因此高頻模型可再考量更多參數,如元件工作溫度及磁性元件的導磁係數等,以達成更完整的高頻模型。另外,影響EMI的因素還包含一些環境問題,如測試連結線材及雜訊背景值等,因此上述的條件若能再考量進去,將有助於完成EMI模擬電路。
The purpose of this thesis is to investigate the generalization of the conducted EMI model developed earlier by Lin [1]. Both measurements and simulation for conducted EMI are performed to verity the high frequency model proposed earlier by Lin [1]. The application circuit is that of boost power factor correctors. Experiment steps: (1) simulation of a boost power factor corrector in operation to identify low frequency problems, (2) including high frequency characteristics in low frequency component models to account for the 150 kHz ~ 30 MHz frequency range of conducted EMI in practical measurements.
First, measurements and simulation for each separate component are conducted to verify their impedances and phase curves. The model is included in the circuit to simulate conducted EMI. Finally, simulation and measured EMI noises are compared to investigate whether the model is suitable for the frequency range of conducted EMI or not. The problematic electromagnetic interference can be predicted. Thus, time and cost of circuit design can be reduced.
Considering the results of applying high-frequency model by Lin [1], the comparison results show that the EMI of different circuits will have different influence factors, including circuit structure, component characteristics, circuit design, PCB layout, and so on. Therefore, the high-frequency model should be concerned about more parameters, such as working temperatures of components, the permeability of magnetic components, and so on, for designing a further complete high-frequency model. In addition, the factors influencing EMI also include some environmental problems, such as the testing cables of measuring instruments, noise value, and so on. Thus, if the condition mentioned above can be considered, the model will facilitate EMI simulations of circuits.
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