研究生: |
許廷宇 Ting-Yu HSU |
---|---|
論文名稱: |
奈米級及次微米級核殼型橡膠添加劑、無機矽膠/有機高分子核殼型顆粒、及蒙特納石黏土對不飽和聚酯、乙烯基酯、及環氧樹脂之聚合固化反應動力及玻璃轉移溫度之影響研究 Effects of nano-scale and submicron-scale core-shell rubber additives, inorganic silica gel/organic polymer core-shell particle, and montmorillonite clay on the cure kinetics and glass transition temperatures for unsaturated polyester, vinyl ester, and epoxy resins |
指導教授: |
黃延吉
Yan-Jyi Huang |
口試委員: |
陳崇賢
none 邱文英 none |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 化學工程系 Department of Chemical Engineering |
論文出版年: | 2009 |
畢業學年度: | 97 |
語文別: | 中文 |
論文頁數: | 360 |
中文關鍵詞: | 奈米級及次微米級核殼型橡膠添加劑 、無機矽膠/有機高分子核殼型顆粒 、蒙特納石黏土 、不飽和聚酯 、乙烯基酯 、環氧樹脂 、聚合固化反應動力 、玻璃轉移溫度 |
外文關鍵詞: | core-shell rubber (CSR), low-profile additive (LPA), inorganic silica gel/organic polymer core-shell, unsaturated polyester (UP), glass transition temperature |
相關次數: | 點閱:443 下載:1 |
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本文乃探討三種特用添加劑,分別為:(1)奈米級及次微米級核殼型橡膠(core-shell rubber)添加劑(2)無機矽膠/有機高分子核殼型顆粒及(3)矽烷改質蒙特納石黏土(montmorillonite clay,MMT),其對苯乙烯/不飽和聚脂(或乙烯基酯)/特用添加劑三成份系統及環氧樹脂/硬化劑/特用添加劑三成份系統之聚合固化動力及玻璃轉移溫度影響。吾人利用微分掃描熱分析儀(DSC)及傅立葉轉換紅外光譜儀(FTIR)測量ST/UP(or VER)/additive三成份系在聚合固化過程中之反應動力。最後依據Takayanagi機械模式,ST/UP(or VER) /additive三成份系及環氧樹脂/硬化劑/additive三成份系聚合固化後的樣品,其在各相區之玻璃轉移溫度,吾人亦以動態機械測定儀(DMA)測量之。
Abstract
The effects of nano-scale and submicron-scale core shell rubbers (CSR) as low-profile additives (LPA), and inorganic silica gel/organic polymer core-shell particle,and silane treated montmorillonite clay (MMT) on the cure kinetics and glass transition temperatures for styrene/unsaturated polyester (or vinyl ester) /additive ternary systems and epoxy/curing agent /additive ternary systems have been investigated. The reaction kinetics for the ST/UP (or VER)/additive ternary system and epoxy/curing agent /additive ternary systems during the cure was measured by differential scanning calorimetry (DSC) and Fourier transform infrared spectrometry (FTIR). Finally, based on the Takayanagi mechanical models, the glass transition temperature in each region of the cured samples for ST/UP (or VER)/additive ternary systems and epoxy/curing agent /additive ternary systems has been measured by the dynamic mechanical analysis (DMA).
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