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研究生: 柯敦元
Dun-Yuan Ke
論文名稱: 雷射退火矽膜之晶粒位置控制技術開發
Location Control of Grains in Excimer Laser Crystalline of Silicon Thin Films
指導教授: 葉文昌
Wen-Chang Yeh
口試委員: 莊敏宏
Miin-Horng Juang
冉曉雯
none
野口隆
Takashi Noguchi
森本家宏
Yoshihiro Morimoto
學位類別: 碩士
Master
系所名稱: 電資學院 - 電子工程系
Department of Electronic and Computer Engineering
論文出版年: 2006
畢業學年度: 94
語文別: 中文
論文頁數: 52
中文關鍵詞: 晶粒定位技術微透鏡陣列HREC準分子雷射退火
外文關鍵詞: Location control, Microlenses array(MLA), HREC, ELA
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  • 本論文以原創且簡易的方式實現矽膜晶粒定位技術,其中分別有針狀型矽島陣列輔助晶粒定位和微透鏡陣列輔助晶粒定位兩種技術。前者,藉由SiON半透光膜輔助,成功的抑制住矽島橫向長晶,只需持續提高吸收係數,矽島單晶化目標即可實現。後者,將準分子雷射經過微透鏡陣列聚焦成微光束退火矽膜,得到之微晶粒當成晶種進行再次雷射退火,成功的實現晶粒位置控制,以此技術搭配HREC得到直徑10μm定位晶粒之陣列。使用XRD分析,定位晶粒主要結晶方位為<111>。


    In this paper, some novel methods for location control of silicon grains by original and convenient way was realized. Its is location control of silicon grains by acicular silicon island array to assist and location control of silicon grains by microlenses array to assist separately in two kinds of technology. The former, assists by SiON translucent films, we have successfully restraining the silicon islands lateral growth of crystallization, only need takes the accurate crystalline time of silicon island of control, silicon islands form to single crystallization that can be realized. The latter, Micro-melt of Si film as a seed was formed by focusing excimer laser by microlenses array(MLA), the film was re-melted by uniform excimer laser, location control of silicon grains was realized, match HREC and receive the diameter 10μm grains array of location control with this technology. To analyse by XRD, the orient is <111> of the main crystallization position of crystalline grains. No additional photolithography process or precision excimer laser optical systems are necessary in this method.

    目錄 第一章前言 1-1前言…………………………………………………[1] 1-2準分子雷射退火原理………………………………[3] 1-3ELA結晶技術介紹…………………………………[6] 1-4研究背景……………………………………………[8] 1-5論文流程……………………………………………[10] 第二章矽半島誘發矽島結晶技術開發 2-1前言…………………………………………………[11] 2-2實驗方法……………………………………………[12] 2-3結果與討論…………………………………………[16] 2-4本章結論……………………………………………[19] 第三章微透鏡陣列輔助晶粒定位技術開發 3-1前言…………………………………………………[20] 3-2實驗方法……………………………………………[20] 3-2.1 微透鏡陣列製作流程簡介……………………[21] 3-2.2 微影製程………………………………………[21] 3-2.3 反應性離子蝕刻………………………………[25] 3-2.4 晶粒陣列定位技術……………………………[26] 3-3結果與討論 3-3.1微透鏡陣列結果分析……………………………[29] 3-3.2晶種之雷射能量依存性…………………………[31] 3-3.3晶粒定位技術之實現……………………………[33] 3-3.4熱滯留層輔助晶粒定位技術之實現……………[36] 3-3.5改善晶種存在於定位晶粒中央之問題…………[40] 3-3.6矽膜之XRD光譜分析……………………………[45] 3-4本章結論………………………………………………….[47] 第四章結論………………………………… [48] 參考文獻……………………………………………[50]

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