飛秒雷射具有超短脈衝以及光能量密度極高的特性，且擁有特殊的光化學材料剝離機制。這些特性使其有別於一般雷射而有加工熱影響區小、加工尺寸精密度高、以及熱應力低所帶來的內部加工優勢。利用這些特點，本研究以飛秒雷射進行內部結構光擴散片加工與矽晶圓裂片加工兩部份的創新應用研究。
內部加工所製作之光學元件相較於一般的表面加工，具有結構不磨損、不易產生加工粉塵、元件間結合貼附容易且緊密性良好之優勢。本研究成功利用飛秒雷射在透明材料PMMA中製做內部光學擴散片，並對其進行光學性質之量測。矽晶圓裂片部分，利用飛秒雷射無熱精密加工之特性，直接於矽晶片表面進行加工造成切口以利裂片。結果顯示除可使表面加工線寬縮至5μm以下、讓其切割道極小化以提升晶片產能外，更具有加工粉塵易清除以及裂口平整之優點。
本研究以飛秒雷射加工成功驗證了內部光學擴散片和矽晶圓裂片之兩種創新加工法，不僅符合輕薄短小之微奈米加工需求，更對半導體、光電能源與影像顯示等領域之應用提供一個重要的方向。

The femtosecond laser is categorized as ultra-short pulse laser. In contrast to general laser, femtosecond laser is characterized with high energy density and specific mechanism of photochemical material peeling. Moreover, it has the advantages of trivial heat-affected-zone, high precision machining, and the capability of internal processing on transparent materials due to its low thermal stress. Based on these benefits, two typical issues, internal light diffuser, and silicon wafer dicing, with the use of femtosecond laser were studied.
The internal structure has durable, dust-free, and excellent adherent characteristics. In this study, a PPMA internal light diffuser was successfully manufactured, and the relative optical properties were measured and well discussed. On the other hand, for silicon wafer dicing, this study chose using femtosecond laser to carve directly on the wafer surface instead of in the interior, because of the low thermal stress characteristic. Results showed that the advantages of femtosecond laser surface dicing including not only the sub-5m groove width, which means the wafer productivity could then be enhanced, but also the smooth cross-sectional surface and dust could be easily removed.
Both the results on these two categories confirmed the potentiality of femtosecond laser applications in micro-scaled machining, like semiconductor, photovoltaic, and image display.

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