本研究針對在環保壓模膠轉換時所面臨的困難點提出解決之道。其所謂困難點則集中於壓模時材料的成型性和其一些影響良率和產能的缺點，比如現有模具於環保膠(Green Compound)之生產造成之未充滿，膠道堵塞，膠體崩裂和連續模太短等。所謂環保膠即該膠種不含銻(Antimony)及溴(Bromine)等滷化物(Halogen)成份於其生產及最終產品上，且因其環保(不得含鉛成份)的接著劑用於IC和電路板之銲接(如SMT),其溶點亦由原220℃提高至260℃之工作溫度，然輕薄短小封裝的要求並未間斷, 故而造成新研發環保膠為通過其原有可靠度及符合環保要求不得不在成型性上做些讓步，且環保膠轉換是沒有回頭路，也不得在時間上延遲，因為客戶於新一代產品的需求是不會等待。因此是勢在必行且限期完成。
本研究以實際生產案例解決為研究範圍，研究主體為目前業界最普遍的薄型高分子塑膠封裝體(TQFP和TSSOP有接腳材料)，以相關應用學理為依據，實際驗證結果為指標，針對該膠體缺點之現象和因素做深入的分析.

The study focus on the solution for the problem of Green molding compounds conversion. The problem includes the barriers on the mold ability and throughput capacity, such as incomplete package, runner block, package chipping and short clean span each consecutive shot. So-called Green means exclude Antimony & Bromine Halogen elements during its production & final products. Hence, solder join process raise its working temperature from 220℃ to 260℃ in the strategy smaller package and without function degradation.
This study ambit focus on the solution of real production case. TQFP and TSSOP packages are used in this study as a representation package. This study use experiment as main data with D.O.E as an auxiliary tooling, and regard production line data as a verification to identify the factors of the barrier to conversion. Key jobs in this study are the formed mechanics and factors identification. Final, we concluded that the key factors from such many mold-ability due to high compound sticky and small compound shrinkage rate of its properties.

1. Linda Sawyet and David Grubb , Polymer Microscopy, Chapman & Hall page 1~page 16
2. Michael G. Pecht et al.,Plastic-Encapsulated Microelectronics,P.1, 1995
3. Louis T. Manzione, Plastic packaging of Microelectronics Devices, P.100,1990.
4. Sumitomo Baklite Taiwan Co., Ltd, Technical Seminar for IC packaging Materials in Taiwan; 2004 and 2005 technical report
5. Han, W.G. Kim,H.G. Yoon and T.J. Moon, J.Apply. polym. Sci., 36,773,1998
6. J.M. Castro,C.W.Macosko and J.Perry,Polym.,25,82,1984.
7. Emeryc Valot, Europeam Coating Journal, n6,438,1998.
8. Glodfarb .B and Bussey, H.E.,Rev. Sci. Instrum., 58,p624, 1987.
9. Rolf W. Biernath and David S.Soane,Contemporary Topics in Polymer Science, 7,103,1992.
10. L.T. Nguyen,The First Asia-Pacfic conerence on Materials and process in IC Encapsulatio Proceedings, 1996
11. L. T. Manzione, Plastic Packging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990.
12. R. R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New Yow, 2001.
13. D.P. Seraphim, R.C. Lasky and C.Y. Li, Principles of Electronic Packaging, McGraw-Hill, 1989
14. R.J. Hannemann, A.D. Kraus and M. Pecht, Semiconductor Packing, A Multidisciplinary approach, John Wiley & Sons, New York, 1994.
15. C. P. Hsu and L.J. Lee, Polymer Engineer Science, 11, 45 (1989)
16. S. M. Anaroni, Synthesis, Characterization and Theory of Polymeric Network and Gels Plenum Pres., New Work (1992)
17. Yeong-Show and Laurent Supene, Polymer Engineering Science, 31, 321 (1991)
18. V.B. Gupta et al.,Polymer,34(2),P.289,1993
19. John B.ENNs and John K. Gillham, J. Appl. Polym. Sci.,28,2567,1983
20. G. Messner, I. Turlik, J.W. Blade and P.E. Garrou, Thin Film Multichip Modules, ISHM, 1992.
21. F.M. White, Viscous Fluid Flow, McGraw-Hill Inc., New York, 1991.
22. Su, Francis, Sheng-Jye Hwang, Huei-Huang Lee and Durn-Yuan
Huang, Prediction of Paddle Shift via 3D TSOP Modeling, IEEE Transaction on Components and Packaging Technology, 23, p684-692,2000
23. Polymer Engineering and Science, Mid. Mar, 1996, Vol. 36, 1994.
24. Su, Jerry, Sheng-Jye Hwang, Francis Su and Shou-Kang Chen, An Efficient Solution for Wire Sweep Analysis in IC Packaging, ASME Journal of Electronic Packaging, 125, p139-143 ,2003.
25. Pei, Chien-Chang and Sheng-Jye Hwang,Prediction of Wire Sweep during the Encapsulation of IC Packaging with Wire Density Effect, ASME Journal of Electronic Packaging ,2004.
26. Chang, Shang-Jye and Sheng-Jye Hwang, A Study on the Adhesion Between EMC and IC Encapsulation Mold, Proceedings of the Seventh International Conference on Automation Technology, Chia-yi, Taiwan, p180,2003.