本研究是針對先前研究的拋棄式體外檢測晶片(In-Vitro Diagnosis Chip)之結合製程所提出的改良型UV膠黏接製程，將其應用於實際的微流體晶片黏接。實驗用之微流體晶片由微銑削機來製作，並將此微流體晶片以改良型UV膠黏接製程達到快速貼合的目標。本研究所開發之改良型UV膠黏接製程有兩個主要的設計，首先我們使用旋轉塗佈的方式將UV膠塗佈在壓克力披覆基材之上，旋轉塗佈時會採用兩段不同的轉速來進行，第一段轉速為較低轉速，其目的是為了將UV膠均勻地散佈在披覆基材之上。而第二段轉速為較高轉速，來將均勻散佈的UV膠旋塗至黏接所需要的UV膠厚度。另外我們於流道晶片上設計許多微小突起的結構，其目的是控制晶片貼合時的間距，來防止固化前液體狀UV膠流入微流道造成堵塞的情形。黏接過程中也發現當微流道越小時，流道堵塞的情形將會因為毛細力以及UV膠黏度的關係而越加嚴重。因此透過表面疏水改質的方式提升晶片壁面的接觸角，增加壁面阻力來防止膠體流入流道之中，而從流道斷面的檢測也可以發現UV膠體流入比率和流道品質確實有所改善。

The major goal of this research is to develop a rapid and reliable bonding technique of disposable microfluidic devices for a mass production line. The original idea of this method was from the regular UV glue bonding, and what we focused herein was to prevent the UV glue flow into the microchannel during the bonding process. Two approaches were used to achieve excellent bonding of microfluidic chips without any glue clogging, including (1) using spin coating of UV glue to achieve uniform and thin glue layer, and (2) carefully designing the standing structures on the chips to maintain a tiny gap between the two substrates. In the experiments, multiple PMMA microfluidic chips with a cross-sectional area of 200μm × 200μm were fabricated with a micromilling machine. On the other hand, we also use some process improvement and design to assist our two approach when the microchannel is getting tiny, the capillary force will lead the glue flow into the microchnnel. And the experiment results showed that averagely only 2-3% of the cross-sectional areas were occupied by the glue after investigating the cross-sectional areas of multiple bonded chips. To fully understand this method’s limitation, multiple experiments were planned to study the impact of various factors to the bonding performance.

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