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研究生： 陳文彥
Wen-Yan Chen
論文名稱： 白光發光二極體封裝研究
Study of White Light Emitting Diode Package
指導教授： 蘇忠傑
Jung-Chieh Su
口試委員: 李三良
San-Liang Lee
李奎毅
Kuei-Yi Lee
林堅楊
Jian-Yang Lin
學位類別： 碩士
Master
系所名稱： 電資學院 - 電子工程系
Department of Electronic and Computer Engineering
論文出版年： 2008
畢業學年度： 96
語文別： 中文
論文頁數： 69
中文關鍵詞： 白光發光二極體 、光子晶體
外文關鍵詞： white light LED, Photonic crystal
相關次數： 點閱：322  下載：8 
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  •  上一筆

    • 使用白光LED是目前照明的趨勢，使用紫外光LED加上螢光粉做製成的白光LED因為有許多優點，例如演色性高、色座標接近白光(0.33,0.33)等，是很有潛力的技術。但其缺點在發光效率不佳，及封裝材料特性不穩定。實驗證明在雙層封裝的情況下，可得到色座標接近(0.33,0.33)，色溫5700K左右，平均演色指數92的白光，同時也能提升色溫隨角度變化的穩定性，加入光子晶體後可將發光效率增加10%左右。此外，本研究也討論了白光LED劣化現象。

    White light emitting diodes (LEDs) are attractive for using as an illumination light source. Phosphor-converted white light LEDs, fabricated by near ultraviolate (UV) LED chips, have many advantages such as high color rendering index (CRI), and near true white chromaticity coordinates. However, the drawbacks of the white light LEDs are low luminous efficiency and instability of packaging materials.
    White light LED fabricated by two layers packaging structure was demonstrated. The requirements of lighting source such as correlated color temperature, average color rendering index (Ra) and chromaticity coordinates were measured. The correlated color temperature of white light LED is 5700K. The average color rendering index is 92 and chromaticity coordinates is (0.33, 0.33) respectively. The instability of correlated color temperature (CCT) with the light emitting angle is improved. The enhancement of luminous efficiency is about 10% by applying a photonic crystal on top of the white LED. The degradation of white light LED was discussed at the same time.

    摘要 I 誌謝 III 目錄 IV 圖目錄 VI 表目錄 VIII 第一章 緒論 1.1 背景 1 1.2 白光LED介紹 1 1.2.1 藍光LED加黃色螢光粉 1 1.2.2 多色晶粒混光LED 2 1.2.3 UV LED加三色螢光粉 3 1.3 提高白光LED效率方法 4 1.3.1 調整螢光粉配方濃度 4 1.3.2 改善晶粒結構 4 1.3.3 改變晶粒封裝 5 1.3.4 散熱與電路設計 6 1.4 幅射度學與光度學 7 1.4.1 幅射通量與光通量 7 1.4.2 幅射照度與光照度 8 1.4.3 幅射亮度與光亮度 8 1.4.4 LUV色彩空間與色差 9 1.4.5 相對色溫 11 1.4.6 演色性 12 第二章 實驗 14 2.1 材料調配 14 2.1.1 螢光粉材料 14 2.1.2 矽膠 17 2.1.3 田口式實驗法原理 18 2.1.4 奈米粉提高有效折射率 18 2.1.5 螢光粉濃度與總量關係 19 2.1.6 劣化現象 20 2.2 封裝結構 21 2.2.1 單層封裝方法 21 2.2.2 雙層封裝方法 22 2.2.3 光子晶體封裝與介紹 23 2.3 量測方法原理與儀器 25 2.3.1 積分球原理與儀器 25 2.3.2 光分佈量測儀器介紹 27 2.3.3 I-V曲線 28 2.3.4 封裝熱阻量測法 29 第三章 討論 31 3.1 材料調配比較 31 3.1.1 奈米粉與膠之比例與發光強度關係 31 3.1.2 奈米粉與膠之比例與配光曲線關係 34 3.1.3 奈米粉與膠之比例與I-V曲線關係 36 3.1.4 螢光粉濃度厚度與發光強度關係 37 3.1.5 螢光粉總量與I-V曲線關係 40 3.1.6 螢光粉總量與配光曲線關係 41 3.1.7 螢光粉總量與轉換效率 43 3.2 封裝結構比較 45 3.2.1 光子晶體封裝前與封裝後之光譜 45 3.2.2 單層結構與雙層結構光譜 50 3.2.3 單層結構與雙層結構I-V曲線 52 3.2.4 單層結構與雙層結構配光曲線 53 3.2.5 單層結構與雙層結構封裝熱阻係數 54 3.2.6 SEM截面圖 55 3.2.7 白光LED實物圖 56 3.3 封裝可靠度與劣化現象 56 3.3.1 熱劣化 56 3.3.2 螢光粉沉澱劣化 57 3.3.3 矽膠劣化 58 第四章 結論與建議 60 4.1 結論 60 4.2 未來發展方向與建議 61 參考文獻 62 附錄 64

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