本研究主要之目的是對覆晶(Flip chip)構裝製程上所使用之錫球凸塊高度進行高度重建，由於錫球凸塊的大小跟共面性對於封裝後電子元件之效能影響甚鉅，故對於錫球凸塊的形貌資訊是不可或缺的。
本研究應用數位光處理(digital light processing, DLP)投影機做為投影光源，利用四步及六步相位平移輪廓法進行機台精度的計算以及覆晶構裝上錫球凸塊之重建。對於因為光學透鏡所造成之投影光源不均勻之現象，使用了仿射座標轉換(affine coordinate transformation)找出投影光源對應至影像擷取元件之座標轉換關係，再利用投影均勻光源推估出光源不均勻之分佈，最後配合座標轉換之參數成功地將光源不均之問題解決，成功的將弦波擬合均方根誤差達10.5的未進行光源校正之條紋，大量降低至2.902。條紋參數之調整，使用了灰關聯分析來進行參數對於解纏繞平面的影響分析，並應用解纏繞平面之最佳直線定義解纏繞平面之平整性，使用多組不同條紋之影像配合迴歸分析理論找出條紋之最佳參數，並配合適應性k值求取高度重建之參數，解決的斜向投影產生條紋變形的問題。
經由實驗結果確認，振幅之平均灰關聯係數為0.5612，週期之平均灰關聯係數為0.537，且由迴歸模型也驗證了灰關聯係數計算之結果。本研究所使用之實驗機台應用四步相位平移平均誤差3.57 um，最大誤差為4.74 um，最大標準差為8.38 um；六步相位平移平均誤差1.19 um，最大誤差為2.92 um，最大標準差為4.95 um，顯示本研究所使用之實驗機台具有高精度及重現性。經由四步及六步之相位平移輪廓法之重建結果，發現六步相位平移輪廓法對於漫射干擾的抵抗力極優。

This study reconstructed the height of the solder bumps for flip chip packaging process. As the size and coplanarity of solder bumps have significant influences on the effectiveness of the packaged electronic modules, the shape information of solder bumps is indispensable.
This study used digital light processing (DLP) projector as the projection light source, and used 4-steps phase shifting profilometry and 6-steps phase shifting profilometry to calculate the machine accuracy and reconstruct the solder bumps in flip chip packaging. For the nonuniformity of projection light source resulted from optical lens, the affine coordinate transformation was used to determine the coordinate transformation relationship between projection light source and image capture component. The nonuniform distribution of light source was estimated by projecting uniform light source. Finally, the parameters of coordinate transformation were used to solve the problem of nonuniform light source successfully. The cosine fitting RMSE of 10.5 of the stripes without light source correction was reduced to 2.902 significantly. In terms of adjustment of stripe parameters, the gray relative analysis method was used to analyze the influence of the parameters on the phase unwrapping plane, and the best straight line of phase unwrapping plane was used to define the leveling of the phase unwrapping plane. Multiple images of different stripes and the theory of regression analysis were used to determine the optimal parameters of stripes. The adaptive k value was used to determine the parameters of height reconstruction, and the stripe transformation resulted from oblique projection was solved.
The experimental results proved that the average gray correlation coefficient of amplitude is 0.5612, the average gray correlation coefficient of period is 0.537, and the regression model has validated the results of gray correlation coefficient. The mean error of the experimental machine used in this study using 4-steps phase shifting is 3.57 um , the maximum error is 4.74 um , and the maximum standard deviation is 8.38 um . The mean error of 6-steps phase shifting is 1.19 um, the maximum error is 2.92 um, and the maximum standard deviation is 4.95 um. In other words, the experimental machine used in this study has high precision and reproducibility. According to the reconstruction results of 4-steps and 6-steps phase shifting profilometry, the 6-steps phase shifting profilometry has excellent resistance to the diffusion interference.

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