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研究生: 廖政慶
Zheng-Qing Liao
論文名稱: 應用微量潤滑於鑽石線鋸製程及小型複線式線鋸機之開發
Applying Minimum Quantity Lubrication To Fixed Diamond Wire Sawing Process And Development Of Small-Scale Wire Saw Machine
指導教授: 鍾俊輝
Chun-hui.Chung
口試委員: 陳炤彰
Chao-chang chen
陳品銓
Pin-chuan Chen
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2014
畢業學年度: 102
語文別: 中文
論文頁數: 64
中文關鍵詞: 複線式線鋸MQL磨削比鑽石線
外文關鍵詞: Multi-Wire Saw, MQL, Grinding Ratio, Diamand Coated Wire
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  • 本研究有兩大主旨,其一,將鑽石線鋸製程更改潤滑條件,根據 Minimum Quantity Lubrication (MQL)理論將潤滑條件分為切削液、切削液噴霧、水噴霧及空氣共四種,探討不同潤滑條件下鑽石線之磨耗行為。實驗機台以本實驗室自行開發之鑽石線材測試機為平台,此機台可量測線張力及切削力變化,同時以雷射位移計偵測即時切深變化,由實際之切削試驗評估不同潤滑條件下之切削能力表現。實驗後以掃描式電子顯微鏡觀測磨耗程度並記錄。實驗後以最大切削力、雷射位移計量測之高度位置變化、鑽石顆粒磨耗量及磨削比四種實驗結果,評估上述四種潤滑條件之優劣,結果以切削液及切削液噴霧兩種潤滑條件最為優良,但切削液噴霧用量相較於傳統之切削液使用方式來的小,可在相似的切削效能下達到節省成本及環境保護的目的。
    其二,在晶圓製程中,一般商用複線式線鋸機切削晶圓至少要6個馬達來控制切割線的作動及張力,其中包含Bobbin 2個、Dancer 2個及Guide 2個,另外還有工件進給平台,這些馬達將同時影響線張力、線速度及線的運動,因此,同時控制這些馬達的運算是很困難的。而本研究目的在於開發一台小型複線式線鋸機,若依照商用機台進行切割線運動及張力控制,將無法達到機台簡化的目的,故本研究設計新的繞線機構,其合併進給和回收的線軸,並藉由齒輪及連桿機構達到應有的功能,不僅減少馬達的使用量,且仍然能提供固定的線速度和控制線的位置及平均每條線的張力,因此,僅需一個Z軸載臺與伺服馬達驅動,便能達到與一般商用的複線式線鋸機相同的功能。


    This study has two subjects. First, in this study, the application of Minimum Quantity Lubrication (MQL) is investigated for fixed diamond wire sawing process. The cutting behavior is studied under four lubrication conditions: coolant, air, coolant mist and water mist. Experiments were conducted on a customized wire sawing machine. During the test, the cutting force and the depth of cut were monitored by a pair of load cells and a laser displacement sensor. The wear of the diamond grits was observed by the SEM images of the used wires. The results show that the coolant mist lubrication performed as efficient as the coolant. In addition, the grinding ratio is about three times higher than that with air condition. Therefore, coolant mist has the potential to reduce the cost of fixed diamond wire sawing process and is benign to the environment.
    Another subject is development of small-scale wire saw machine. Multi-wire sawing is widely used to slice semiconductor materials into thin wafers in wafer manufacturing process. In typical wire sawing machines, a number of servo motors are required for driving wire transmitting mechanisms, in which two motors for the wire bobbins, two motors for the dancer, and two motors for wire guides are required. The large number of motors makes the system complex to be controlled and costly. In this study, an innovative winding mechanism has been designed and fabricated for a simplified multi-wire sawing machine. The new mechanism uses only one motor for the wire feeding and collecting bobbins which are connected by linking mechanisms and gear box to introduce proper helical motion. This design reduces the required motors while the machine still maintains the ability of controlling wire speed and wire motion as in the commercial wire sawing machines.

    摘要 Abstract 致謝 表索引 圖索引 第1章 緒論 1.1 研究背景 1.2 研究目的與方法 1.3 論文架構 第2章 文獻回顧 2.1 脆性材料性質研究 2.2 線鋸切割技術 2.3 微量潤滑切削 2.4 文獻回顧總結 2.4.1 複式線鋸 2.4.2 Minimum Quantity Lubrication 第3章 實驗耗材與設備 3.1 實驗與量測設備 3.1.1 鑽石線試驗機 3.1.2 小型複線式線鋸機 3.1.3 雷射位移計 3.1.4 虹吸式二流體噴嘴 3.1.5 掃描式電子顯微鏡 3.1.6 工具顯微鏡 3.2 實驗耗材 3.2.1 單晶矽晶錠 3.2.2 冷卻液 3.2.3 鑽石線 3.2.4 混合型之環氧化物接著劑 3.2.5 犧牲材 第4章 應用Minimum Quantity Lubrication於鑽石線鋸製程 4.1 實驗參數設定 4.2 切削力分析 4.2.1 信號處理 4.2.2 最大切削力 4.2.3 平均切削力 4.3 切削深度 4.4 鑽石顆粒磨耗高度 4.5 磨削比 4.6 磨耗試驗結果比較 第5章 機臺設計與機構分析 5.1 張力穩定器 5.1.1 線張力分析 5.2 繞線機構 5.2.1 減速齒輪組 5.2.2 線速度計算 5.3 線預張力設計 5.4 控制系統 5.4.1 電控升降臺 5.4.2 伺服馬達 5.4.3 控制介面 5.5 晶錠切割參數設定 5.6 小型複線式線鋸機試切結果 5.6.1 矽基板表面 5.6.2 切片厚度 第6章 結論與未來展望 6.1 結論 6.1.1 應用Minimum Quantity Lubrication 於鑽石線鋸製程 6.1.2 小型複線式線鋸機之開發 6.2 未來展望 6.2.1 鑽石線磨耗試驗 6.2.2 小型複線式線鋸機之設計 參考文獻 附錄A控制程式碼 附錄B伺服驅動器之PID

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