影像式自動化量測系統因具備非接觸式、高解析度的優點，近年來被廣泛應用於微小元件量測。然而現有影像式量測系統普遍受限於電腦影像資料處理運算速度，其量測範圍與實際應用亦因此大幅受限，為此本研究提出一套在FPGA架構中實現高可調性之影像式精密量測系統，並以微小角度、微距量測與物體形貌重建量測實驗驗證本系統性能。
本系統以Camera Link 介面VC-4MC-M180相機工業相機擷取影像，並結合Moiré演算法與掃描式輪廓技術重建出晶圓形貌。開發系統使用的硬體與軟體主要分別為Xilinx Virtex-5 SX95T晶片的NI FPGA 7966R、影像擷取卡NI 1483與Labview FPGA。為了提升系統效能，本研究藉由對2048×2048解析度影像擷取感興趣區域做影像處理與疊紋分析運算，實現幀率157.1 fps之高速且即時晶圓曲率量測系統。實驗結果顯示於處理影像幀率為39.6 fps下，本系統有效量測晶圓曲率變化量可達3100 μrad、有效量測變化量之頻率達1.9 Hz與晶圓曲率量測解析度約為4 μrad，相較於PC架構量測系統之量測結果，本系統量測效能大幅優於PC架構。此外本研究亦分析各演算法所消耗的FPGA邏輯單元使用情況，以利未來實現於低成本之量測系統開發。

Image-based automatic inspection systems have the advantages of non-contact measurement and high resolution. However, the effective measurement range and performance are also greatly limited by the computational efficiency in most available computer systems. This thesis presents a FPGA-based precision measurement system and justifies its system performance with several tests including micro-angle variation measurement, distance measurement, and object surface reconstruction.
To achieve high speed and real-time wafer warpage measurement, this study implemented image processing and moiré algorithms on a large region of interest in which its maximum processing speed could be up to 157.1 fps with a 2048 × 2048 image resolution. The measured results of this FPGA-based system are justified using the ones measured by high precision commercial instruments. The experimental results demonstrate that at a 39.6 fps image frame rate the effective warpage measurement range could be up to 3100 μrad with a 1.9 Hz maximum measurement variation frequency and a 4 μrad resolution. Compared to the results obtained from a PC based image measurement system, the performance of our developed FPGA-based measurement system has been significantly improved. Moreover, the analysis of the used FPGA logic units is also presented for more effectively-streamlined commercial developments in the future.

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