本論文提出了針對應用於毫米波雷達系統之微型化饋入架構以及四種應用情境之毫米波連接器設計，第一部份為兩款可應用於毫米波雷達系統之微型化饋入架構，第一款為於鋁塊中以精密加工的方式將同軸纜線放入做為77GHz雷達IC模組與天線間之連接架構，其可以較低的插入損失傳輸，以及藉由鋁塊達到散熱的功效，並且可依不同的應用來更換適當的天線。第二款饋入架構為於鋁塊中圓形波導架構設計，其中乃以六層疊構來連接與饋入圓形波導。此外，本研究亦進行串列式槽孔貼片陣列天線設計以及應用於60GHz與77GHz雷達系統陣列天線之場型量測，並針對串列式槽孔貼片陣列天線量測中所遇到的問題進行探討與提出解決方案，最後討論此兩款天線所搭載雷達系統之測試結果。
第二部份則包含四款不同使用情境之毫米波連接器的設計，第一款為延續RF.4X連接器改善設計，此連接器具有低姿態、可旋轉、製造成本低等優點，在經過適當調整後，可使其反射係數表現提升至50 GHz以下皆低於-14 dB。第二款為內扣式連接器，同樣有著上述連接器之優點，其中藉由調整內部端子構造以及金屬外殼的屏蔽結構，單顆連接器於90 GHz以下可達到VSWR小於 1.5的水準。第三款為坎合高度0.7mm的板對板連接器，其具有低姿態且單顆連接器可傳輸六組射頻訊號的優點。第四款設計是為了滿足5G裝置內高頻訊號傳輸之低衰減要求，其中板端為板對板連接器，而線端為同軸纜線的轉接崁具，以取代損失較高的軟性電路板，特別在長距離連接時，來增加運用上的靈活度。

This thesis proposes the feeding structures of the millimeter-wave radar system and four kinds of millimeter-wave connector design for various applications. The first part includes two versions of the miniaturized feeding structures to be applied to the millimeter-wave radar system. In the first version, a coaxial cable is put into an aluminum block between the 77GHz radar IC module and the antenna by a precision machining method. Thus, low insertion loss can be obtained, heat dissipation is improved with the aluminum block, and appropriate antennas may be exchanged for various applications. The second version of the feeding structure is a circular waveguide structure design in the aluminum block, where a six-layer PCB is used to connect and feed the circular waveguide. Also, this study performs cavity-back patch array antenna design and the antenna pattern measurements of the 60GHz and 77GHz radar systems. Some problems encountered in the measurements are discussed and solutions are proposed. Finally, the test results of the radar systems equipped with those antennas are described.
The second part contains the design of four millimeter-wave connectors for various usage scenarios. The first one improves the design of the RF.4X connector. This connector has a low profile, rotary property and low manufacturing cost. After some appropriate adjustments, the reflection coefficient is lower than -14 dB for frequencies up to 50 GHz. The second one is an inner buckle connector, which also has the advantages of the above connector. By changing the internal pin geometry and the shielding structure of the metal casing, the VSWR of the connector is below 1.5 for frequencies up to 90GHz. The third one is a board-to-board connector with a mating height of 0.7mm. It has a low profile and a single connector can transmit six separate RF signals. The fourth one is specially designed for meeting low loss requirements for high-frequency transmission in 5G devices, where the board end is a board-to-board connector and the line end is a coaxial cable mount. Thus, flexible printed circuit boards can be replaced to achieve low loss and increase application flexibility, particularly for long connections.

[1] D.M. Pozar, “Microwave Engineering,”4rd ed, John Wiley & Sons, Nov. 2011.
[2] Wikipedia, Hirose U.FL,” https://en.wikipedia.org/wiki/Hirose_U.FL.
[3] I-PEX, Board to Board Connector scenarios,”https://www.i-pex.com/tw/Products/advanced_search?enable_smart_filtering=1&enable_realtime_funtion=1&type=5&pitch=0.35&pitch_sign=%3E=&height=0.7&height_sign=%3E=&pinCount=1&pinCount_sign=%3E=.
[4] Molex, Board to Board Connector scenarios, “ https://www.molex.com/molex/products/group?key=board_to_board_connectors&channel=PRODUCTS.
[5] NWInG,「連接器的組成」,FOXCONN, September 2006
[6] 楊上鈜，「應用於毫米波雷達系統之陣列天線與饋入架構設計」，國立臺灣科技大學，中華民國107年7月。
[7] 高酩捷，「第五代無線通訊之毫米波連接器設計」，國立臺灣科技大學，中華民國107年7月。
[8] Douglas Brooks, “Signal Integrity Issues and Printed Circuit Board Design,” Prentice Hall, 2004.
[9] 是德科技，「評估示波器的取樣率 vs. 取樣的詳實度(應用說明)」，中華民國103年
[10] S. H. Hall, H. L. Heck, “Advanced Signal Integrity for High-Speed Digital Design,” John Wiley & Sons, 2009.
[11] Keysight Technologies, “Understanding Oscilloscope Frequency Response and Its Effect on Rise-Time Accuracy (Application Note),” 2014.
[12] 太克科技，「太克科技量測技術研討會課程資料」。
[13] M. Magerl, T. Mandic and A. Baric, "Broadband characterization of SMA connectors by measurements," 2014 37th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO), Opatija, 2014, pp. 104-109.
[14]Southwest Microwave Inc., “The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates,”2011,pp. 8-21
[15] H. W. OTT, “Electromagnetic Compatibility Engineering, John Wiley & Sons,” 2009.
[16] Texas Instruments, “High-Speed Layout Guidelines (Application Report),” 2006.