發光二極體PN接面產生之高熱，將使面臨亮度降低、壽命減短且放射光往長波長位移等嚴重問題，因此本論文提出直線奈米碳管封裝基板之設計與應用，可改善發光二極體散熱問題。利用氫氧化鉀濕蝕刻的方式，在矽（100）基板上蝕刻出立體U型溝槽，並使用熱化學氣相沉積法，在溝槽內部成長高密度且高長度之直線奈米碳管，最後利用金錫合金將發光二極體晶粒黏著於本論文設計之奈米碳管封裝基板，完成封裝製程。
擁有高熱傳導特性與高導電性之直線奈米碳管，結合矽基板製成之封裝基板，在無散熱器輔助下量測，使發光二極體之平均飽和電流至170 mA，發光功率達29 mW，與封裝於一般矽基板之量測結果做比較，可將操作飽和電流達到160 mA以上之機率，由26%提高至55%。
在熱阻量測結果方面，封裝後整體熱阻值為43 ℃/W，此值為銀膠封裝的32%，金錫合金封裝於一般基板的60%，而連續電流量測使發光功率提升20%以上。結果顯示我們成功製作奈米碳管封裝基板，使發光二極體能夠操作到更高電流，發光功率提升，封裝整體熱阻值降低，接面溫度下降，受高熱影響程度減低，提高整體良率。

In light emitting diode (LED) packages for solid-state lighting, poor heat dissipation causes the problem of low efficiency, wavelength shift, and short life time. The design and application of the Si sub-mount with vertically aligned carbon nanotubes for thermal management of LED packaging is proposed so that the heat dissipation of LED can be significantly improved. The 3D U-type groove is fabricated by KOH wet etching on the Si sub-mount. High density, well aligned vertical CNT arrays were synthesized inside the U-type groove by the thermal chemical vapor deposition (CVD) method. Finally, Au-20Sn solder was applyed in the LED bonding and the package process is completed.
For optical measurement without heat sink setup, the light performance measurement of LED packages using the Si sub-mount with vertically aligned carbon nanotubes was tested. The result shows that the average saturation current is 170 mA. The optical power is above 29 mW. The percentage of having >160 mA saturation current is enhanced from 26% to 55% by using the proposed scheme, compared with the LED packages on the conventional Si sub-mount.
For CW measurement with heat sink setup, the result shows that the saturation current is 290 mA which is larger than the values for LED packages with commercial silver epoxy and Au-20Sn solder, respectively. It has up to 1.2 times more optical output power than that of the LED packages without using CNTs.
The thermal resistance of LED packages using the Si sub-mount with vertically aligned carbon nanotubes was found to be 43 ℃/W which is only 32% and 60% of the values for LED packages with commercial silver epoxy and Au-20Sn solder, respectively. It was concluded that the heat dissipation of LED package was greatly improved with the use of the Si sub-mount with vertically aligned carbon nanotubes.

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