傳統個人電腦系統主機熱對流分析對策在電腦業界已有多年研究發展，各式各樣的CPU散熱器令人眼花撩亂，在材質上有純鋁、純銅等，製程上則有擠製加工、刨折加工、衝壓、錫銲等，現在也運用了熱導管技術解決CPU高運算時脈的散熱對策。
對於機殼內部空間非常有限的Mini PC，市面上大部分的CPU散熱器由於體積太大，無法置入機殼中；少部分高度較低的散熱器安裝後，經實測卻發現晶片溫度太高，與散熱器廠商提供的熱阻資料相差太多。另外一個現象是幾乎所有市售的散熱器風扇都是正向對著CPU吹，因為Mini PC機殼內部空間非常有限，無法安裝系統風扇，造成系統內部廢熱無法有效排出。
在本論文中主要是針對Mini PC整體系統的散熱問題作探討，研究方法為利用模擬軟體Icepak來分析不同的散熱器及風扇配置對整體系統的速度場、壓力場及溫度場的影響，並且以實機系統測試的結果與模擬結果相互驗證，藉以分析不同的設計參數對系統散熱性能的影響。本文在後段提出三組改善方案進行模擬，其改善方案(參數)如下：
方案A(外殼開孔率0.75) 數值模擬結果分析
方案B(使用銅底銅鰭片) 數值模擬結果分析
方案C(主機板底部加鋁板) 數值模擬結果分析

利用熱流模擬分析軟體可使熱流設計者在無實際樣機前的設計推論中，有效掌握系統熱場及流場分布的趨勢，減少嘗試錯誤的次數，使設計作業開發期縮短，降低成本並且提高競爭力。而本研究的目的，期望由電腦模擬設計出散熱效果較好的組合，以提供相關廠商對Mini PC整體系統散熱設計開發的參考。

Various thermal solutions for the cooling of traditional personal computers have been in practice for many years and valuable experiences have been accumulated. Every kind of CPU cooler dazzles the eyes. The primary materials used for cooling purpose include Al and Cu, the producing processes include extrusion, dig, punch, solder and so on. The use of heat-pipe technology has been very popular recently since it can solve systems with high thermal cooling demand.
We try to employ the coolers from various vendors and find most coolers can not fit properly inside our mini system well because most coolers are too big for the limited space of Mini PC. A few coolers with lower height can be put inside the mini system but the cooling effect is bad after thermal test and their heat resistances are different with specs provided by their vendors.
The purpose of this study is to analyze the cooling performance of a Mini PC system using numerical and experimental methods. The research investigate the cooling performance of four kinds of cooler experimentally and compare the thermal test results with the simulation results obtained from commercial CFD code, ICEPAK.
Finally three different strategies to improve the thermal performance are proposed and compared by using the CFD code.

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