傳統銅箔積層板製程中，為提高聚醯亞胺與銅箔間的接著強度，必須使用低耐熱性樹脂做為接著劑，針對此缺陷，本研究進行接著型樹脂的合成與熱壓條件的改良，藉此提高銅箔積層板的耐熱性質、電氣性質、加工性質、耐化學性質；首先合成高性能耐高溫樹脂，包括聚氨基甲酸酯尿素醯亞胺樹脂、聚尿素醯亞胺樹脂、聚醯胺醯亞胺樹脂、含醯胺基雙馬來醯亞胺樹脂及聚尿素醯胺醯亞胺樹脂，並針對樹脂成膜性、耐熱性、耐化性及電氣性質加以分析比較，找出適合製作銅箔積層板的樹脂材料。
在未預處理及未使用接著劑狀態下，將所合成的樹脂溶液或薄膜與銅箔進行積層並熱壓處理，在準確控制溫度、壓力及時間等變數下，歸納積層板的最佳熱壓條件，實驗結果發現，PAI-1最佳熱壓條件為235 oC / 5.88 MPa，PAI-2最佳熱壓條件為235 oC / 6.86 MPa，PAI-3最佳熱壓條件為245 oC / 4.90 MPa，PAI-4最佳熱壓條件為380 oC / 4.90 MPa，PUAI最佳熱壓條件為250 oC / 4.90 MPa，ACBI最佳熱壓條件為溫度320 oC / 4.90 MPa。
電氣性質測試中發現PAI-3具有最低的介電常數與散逸因子，而PUAI因含尿素基團，導致電氣性質最差，標準環境下，介電常數需低於5.50，而散逸因子需低於0.035，本研究中的樹脂及積層板皆符合要求；在耐熱性測試及耐化性測試中發現，各樹脂經過高溫或是酸鹼處理後，仍能維持高的剝離強度保持率；含醯胺基雙馬來醯亞胺樹脂在使用偶合劑來增加與銅箔間接著性後，的確會使其剝離強度有顯著的提升。

Three kinds of polyurethane-urea-imide (PUUI) were synthesized. The Polyurethane prepolymer was synthesized from 4,4'-diphenylmethane diiso-cyanate (MDI) and polyethylene glycol (PEG-400), after which the pre-polymer was reacted with 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA) to form polyimide prepolymer, after which the prepolymer was reacted respectively with p-phenylenediamines (PPD), 4,4'-oxydianiline (4,4'-ODA), and 4,4'-methylenedianiline (MDA) to form PUUI-1, PUUI-2, and PUUI-3.
Three kinds of polyurea-imide (PUI) and three kinds of polyamide-imide (PAI) were synthesized. The polyimide prepolymer was synthesized from MDI and PMDA, after which the prepolymer was reacted respectively with PPD, 4,4'-ODA, and MDA to form PUI-1, PUI-2, and PUI-3. The prepolymer was reacted respectively with terephthalic acid (TPA), isophthalic acid (IPA), and 4,4'-oxybisbenzonic acid (OBBA) to form PAI-1, PAI-2, and PAI-3.
Amide-containing bismaleimide (ACBI) resins were prepared using four monomer reactants : 3,4'-oxydianiline (3,4'-ODA), trimellitic anhydride (TMA), maleic anhydride (MA), and 4-aminobenzoic acid. The PAI and polyurea-amide-imide (PUAI) resins were polymerized from five reactants : 4,4'-ODA, 4-nitrobenzoyl chloride, MDI, PMDA, and 3,3'-4,4'-benzophenone tetracar-boxylic dianhydride (BTDA).
Their chemical structures were characterized using elemental analysis (EA), Fourier transform infrared spectrometry (FTIR) and nulclear magnetic resonance (NMR). The thermal properties, electrical properties, solubility, and mechanical properties of these resins were measured, and the optimal hot-press conditions, electrical properties, chemical resistance, peel strength, and heat resistance of resins / copper foil composites were studied.
The experimental results show that the optimal hot-press conditions for PAI-1, PAI-2 and PAI-3 were respectively 235 oC / 5.88 MPa, 235 oC / 6.86 MPa, and 245 oC / 4.90 MPa. For PAI-4, PUAI and ACBI were respectively 380 oC / 4.90 MPa, 250 oC / 4.90 MPa, and 320 oC / 4.90 MPa. The glass transition temperatures of PUI-1, PUI-2 and PUI-3 films occurred respectively at 276 oC, 272 oC and 258 oC, the PAI-1, PAI-2, PAI-3 and PAI-4 films occurred respectively at 232 oC, 233 oC, 236 oC and 360 oC and PUAI films occurred at 229 oC. The dielectric constants of resins / copper foil composites were lower than 5.5 and the dissipation factors were lower than 0.035, those electrical properties in this study met the industrial requirements.
These PAI / copper foil composites exhibited peel strength higher than 2.30 kN/m under normal circumstances and higher than 2.15 kN/m after heating.The order of peel strength was PAI-1 > PAI-3 > PAI-2. The chemical resistancetests showed that the peel strength retention values of the resins / copper foil composites were respectively more than 94 % and more than 92 % after immersing in 10 % H2SO4 solution at 70 oC for 1 h. The ACBI / copper foil composites treating with 0.2% coupling agent NZ97 had the highest peel strength of 2.097 kN/m. The peel strength was 1.57 kN/m after 1h at 300 oC. After treating in 10 % H2SO4 solution at 60 oC for 30 minutes, ACBI composites maintained 88% of their original peel strength.

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