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研究生: 黃昶閔
Chang-Min Huang
論文名稱: 矽橡膠/環氧樹脂硬化反應與IPN結構之研究
A study on curing reaction & interpenetrating polymer networks structure of silicone rubber and epoxy resin blend
指導教授: 邱顯堂
Hsien-Tang Chiu
口試委員: 邱士軒
Shih-Hsuan Chiu
游進陽
Chin-Yang Yu
吳昌謀
Chang-Mou Wu
邱智瑋
Chih-Wei Chiu
學位類別: 碩士
Master
系所名稱: 工程學院 - 材料科學與工程系
Department of Materials Science and Engineering
論文出版年: 2013
畢業學年度: 101
語文別: 中文
論文頁數: 88
中文關鍵詞: 矽橡膠環氧樹脂高分子網目穿插相容性
外文關鍵詞: silicone rubber, epoxy resin, IPN, miscibility
相關次數: 點閱:330下載:6
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本研究主要以高分子混摻(polymer blend)方式將矽橡膠(silicone rubber)與環氧樹脂(epoxy resin)做結合,先以流變儀(Rheometer)決定加工時間和熱示差掃描量熱儀(DSC)決定加熱溫度著手,再探討混合後的情況,以熱動態機械分析(DMA)探討其相容性,以拉伸試驗探討其應力應變,以熱重損失分析(TGA)探討其耐熱性的變化,以接觸角(Contact angle)探討其混合相之親水疏水效果,最後以電子顯微鏡(SEM)觀察其相分離狀況。本研究中為使兩相混合情況更趨一相,亦另添加改質劑矽烷耦合劑(Silane)和吡咯(Pyrrole),矽烷耦合劑在矽氧鍵部分能與矽橡膠反應,胺鏈端能對環氧基開環,而吡咯部分是雙鍵對矽橡膠之末端雙鍵作加成聚合,氮原子攻環氧基開環。在熱重損失部分,隨著矽橡膠比例增加,熱裂解溫度也隨之提高,代表熱穩定性有趨勢的延後,殘渣量的提高,代表熱安定性也跟著提高。在動態機械分析中,以SE55為相容性最佳,且Tg點提高超出原環氧樹脂,其熱性質也隨之提高,加入改質劑後也使兩相拉近,節點增加,代表其網目糾結程度增加。在拉伸試驗中,以SE82比例為佳,加入改質劑後,吡咯(Pyrrole)的效果提升更為明顯。在接觸角中,加入改質劑對疏水效果都有明顯的提升。


This study focuses on synthesis of silicone rubber/epoxy resin composites using polymer blend method. First of all, we used rheometer to determine processing time and dynamic scanning calorimetry (DSC) for optimum process temperature as well. Secondly to evaluate the composites, the dynamic mechanical analysis (DMA) was used for investigating miscibility, thermal gravimetric analysis for thermal resistance, tensile testing for stress-strength analysis, contact angle analysis for Hydrophobic and Hydrophilic effects, and scanning electronic microscopy (SEM) for observing phase separation. Moreover, to obtain the better miscibility and molecular entanglement, we added silane and pyrrole to modify the reaction. In silane part: Si-O can react with silicone rubber and amine result in ring-opening of epoxide group. In pyrrole part: addition polymerization with silicone rubber and nitrogen atom attribute ring-opening in epoxide group. As a result, the more silicone rubber added in composites, the better thermal resistance was obtained. In DMA testing, SE55 composite (Silicone/Epoxy: 5:5) shows the best miscibility and enhance in thermal properties due to the increase in Tg. In the tensile testing, SE82 (Silicone/Epoxy: 8:2) composite has best performance. And hydrophobic property improved for both modifiers added in the composites.

目錄 摘要 I ABSTRACT II 目錄 III 圖目錄 VII 表目錄 X 第1章前言 1 1.1 研究動機 1 1.2 矽橡膠 2 1.2.1 矽橡膠的歷史 2 1.2.2 有機矽分類 4 1.2.3 鍵長及鍵能比較 8 1.2.4 特性 10 1.2.5 製造方式 12 1.3 環氧樹脂 14 1.3.1 簡介 14 1.3.2 發展 14 1.3.3 製造方式 15 1.4 矽烷耦合劑 16 1.4.1 矽烷耦合劑簡介 16 1.4.2 選用矽烷耦合劑的一般原則 18 1.5 聚摻合 23 1.5.1 聚摻合之優點 24 1.6 相分離 25 1.6.1 相容性 25 第2章文獻回顧 26 2.1 矽橡膠與環氧樹脂 26 2.2 IPN 28 2.2.1 IPN簡介與歷史回顧 28 2.2.2 相關研究文獻回顧 33 第3章實驗 34 3.1 實驗材料 34 3.2 實驗配方 35 3.3 實驗方法 36 3.3.1 樣品製備 36 3.3.2 儀器原理及測試方法 36 第4章結果與討論 45 4.1 傅立葉轉換紅外線光譜儀(FOURIER TRANSFORM INFRARED SPECTROMETER,FTIR)45 4.2 熱示差掃描量熱儀(DIFFERENTIAL SCANNING CALORIMERTER,DSC)49 4.3 流變儀 (RHEOMETER)56 4.4 熱重損失分析儀(THERMAL GRACIMETRIC ANALYZER,TGA) 59 4.5 應力與應變(STRESS & STRAIN)64 4.6 熱動態機械分析(DYNAMIC MECHANICAL ANALYSIS,DMA) 68 4.7 硬度(HARDNESS) 73 4.8 接觸角(CONTACT ANGLE) 75 4.9 掃描式電子顯微鏡(SCANNING ELECTRONIC MICROSCOPY,SEM ) 77 第5章結論 84 5.1 化學性質 84 5.2 物理性質 84 參考文獻 85

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