在電子構裝製程中，打線接合技術一直是使用最廣的電路連線方式。打線接合過程中，控制參數的設定或是材料的選擇會對接合強度的大小有顯著的影響。本論文的目的，利用實驗計畫法，探討打線參數(接合時間、接合壓力、接合頻率)及瓷嘴和晶片表面構造與接合強度的關係。
本論文中發現使用粗化瓷嘴可以得到較佳的操作性，並且透過實驗計畫法得到最佳打線參數為：接合時間20 ms、接合頻率50 KHz、接合壓力40 gf、金球厚度15 μm，再由可靠度的長期監控下並無發現LED熄燈之問題，由此可以證明打線接合參數有達到佳化。

Among all electrical packaging, wire bonding process is most popular method for electrical interconnection. During the boning process , parameters and bonding material, for example, capillary and chip, played critical roles.
In this thesis, we investigated how bonding strength varies with capillary, surface roughness of chip, and wire bond parameters, such as bonding time, bonding force, ultrasonic frequency, by design of experiment method.
The design of experiment results indicated that rough capillary is most appropriate for different surface chip, and the optimized bonding parameters are 20 ms, 50 KHz, 40gf, 15um for bonding time, ultrasonic frequency, bonding force and ball thickness respectively.
Finally, we performed the long-term burn-in test on these sample and no defect was found which further confirmed the process optimization successful for the bonding process.

[1] Lextar Electronics LED Package 28108 Design, package RD( 2010)
[2] Lextar Electronics LED Package Process Training report ,JH(2011)
[3] George G. Harman and John Albers, “The Ultrasonic Welding as Applied to Aluminum-and Gold-Wire Bonding in IEEE Transactions on Parts, Hybrids, and Package, Vol.13, Sep. pp.406-(1997)
[4] N. E. Weare, J. N. Antonevich and R. E. Monroe, “Fundamental Studies of Ultrasonic Welding”, Welding Journal Research Supplement, pp.331(1960)
[5] ASM-Wire Bond Advanced Training, Content of Looping(2001)
[6] KNS, High-Strength Gold Ball Bonding Wire， KNS Report, (2002)
[7] ASTM F1269-89, “Test Methods for Destructive Shear Testing of Ball Bonds,” American Society for testing of Materials, 1995
[8] Lextar Electronics 5630 Lead Farm Design, package RD( 2010)
[9] 劉克祺，實驗設計與田口式品質工程，華泰書局，台北(1994)
[10] 黃橋智，實驗計畫與田口工程，惠群企業管理顧問有限公司，桃園(2003)
[11] 彭定國,吳鴻錚,鄭大興，全華科技圖書股份有限公司， MINITAB統計分析與應用，台北(2006)
[12] 陳家旭，打線接合之實驗與有限元素研究，碩士論文，交通大學，新竹(2002)。
[13] 陳博彥，微細銅導線放電結球特性與打線接合強度要因探討，碩士論文，國立成功大學，台南(2008)
[14] 陳耀茂，實驗計畫法導論，育友圖書，台北(2002) 。
[15] 陳志元，LED封裝金線銲接多目標最佳化製程技術開發，碩士論文,國立高雄第一科技大學，高雄(2009) 。
[16] KNS, Capillaries Design Considerations, K&S Evaluation pp.2~12(2002)
[17] 曾永裕， IC 封裝內金線偏移之研究,國立成功大學，碩士論文，台南(2003)
[18] 許榮宗，白光LED製作技術走勢，工業雜誌，P143~155(2005)
[19] 陳隆建，發光二極體之原理與製程，全華圖書公司，台北(2006)。