印刷電路板（Printed Circuit Board, PCB）在所有的電子產品中用來將所有功能不同的積體電路及電子元件以一條條細細的銅導線連接起來，以提供穩定的工作環境，讓電子訊號可以在不同的電子元件之間流通，所以PCB在整個電子產品中，扮演了整合連結所有功能的角色。在有限的面板上無法安置這麼多的電子元件以及衍生出的大量線路，因而有多層板PCB而多層板PCB製程中內層製程(Inner Layer Process）包括貼膜、曝光顯影、蝕刻、脫模等多道工序，其中曝光顯影是將內層線路圖形轉移到PCB板上的過程，因為電路圖形的製作是PCB製作的重點，所以圖形轉移過程對PCB製作來說，有非常重要的意義，所有的影像轉移是利用曝光機設備完成。本論文將針對產學合作廠商旭東科技架構光學模組進行分析，此光學模組為雷射直寫成像系統是將入射光源直接地聚焦或投影至光阻表面上，本文中分析光點陣列動態中光點尺寸為光點變形量依據，根據光學模擬結果預測光點陣列在曝光平面上的光點大小及分析影響光點變形量的誤差因子，在訂定10%的光學容忍誤差內，可以藉由捨去誤差因子來有效降低光點陣列中光點的實驗量測，此外模擬各個光學元件誤差因子所造成光點變形量，以此變形量找出光學架構的建議組裝誤差範圍，進而建立實際光學架構進行量測光點實驗，分析結果找出光學模組中造成光點潛像變化原因進而調整光學架構減少光學誤差以致於增進光學引擎曝光穩定性

Printed circuit boards are used in all electronic products to connect all functional integrated circuits and electronic components with thin copper wires to provide a stable working environment, allowing electronic signals to be used in different electronic components. Circulation, so the PCB plays a role in the integration of all functions in the entire electronic product. There are not many electronic components and a large number of lines that can be placed on a limited panel. Therefore, multi-layer PCB generation and the inner layer process of the multi-layer PCB process includes multiple processes such as filming, exposure develop, etching, and demoulding, which exposure develop is the process of transferring the inner layer circuit pattern to the PCB. Because the circuit pattern is the focus of PCB production, the graphics transfer process is very important for PCB production. All image transfer is using the exposure machine. This theis will analyze the optical module of Shuz Tung Machinery Industrial Co.Ltd. The optical module is a laser direct writing imaging system that directly focuses or projects the incident light source onto the photoresist surface. The dynamic spot size is based on the amount of spot deformation. According to the optical simulation results, the spot size of the spot array on the exposure plane and the error factor affecting the amount of spot deformation are predicted. Within 10% of the optical tolerance error, The experimental measurement of the spot in the spot array can be effectively reduced by ignore the error factor. In addition, the deformation of the spot caused by the error factor of each optical component is simulated, and the recommended assembly error range of the optical structure is found by the spot of deformation. Establish an optical architecture for measuring spot experiments, and the analysis results find out the cause of the deformation in the optical module and adjust the optical structure to reduce the optical error so as to improve the exposure stability of the optical engine.

[1]Printed Circuit Board Designer's Reference; Basics, CHRISTOPHER T. ROBERTSON, Prentice Hall
[2]Printed Circuit Boards: Design, Fabrication, Assembly and Testing, R. S. Khandpur, McGraw-Hill Professional Pub
[3]Z.-C. Lin and W.-J. Wu, "Multiple linear regression analysis of the overlay accuracy model," IEEE transactions on Semiconductor Manufacturing, vol. 12, pp. 229-237, 1999.
[4]M. Rahlves, M. Rezem, K. Boroz, S. Schlangen, E. Reithmeier, and B. Roth,"Flexible, fast, and low-cost production process for polymer based diffractive optics," Optics express
, vol. 23, pp. 3614-3622, 2015
[5]K. Jain, M. Klosner, M. Zemel, and S. Raghunandan, "Flexible Electronics and Displays: High-Resolution, Roll-to-Roll, Projection Lithography and Photoablation Processing Technologies for High-Throughput Production," Proceedings of the IEEE, vol. 93, no. 8, pp. 1500-1510, 2005.
[6] T. Ito and S. Okazaki, "Pushing the limits of lithography," Nature, vol. 406, no. 6799, pp. 1027-1031, 2000.
[7]R. Barbucha, M. Kocik, J. Mizeraczyk, G. Kozioł, and J. Borecki, "Laser Direct Imaging of tracks on PCB covered with laser photoresist," TECHNICAL SCIENCES, vol. 56, no. 1, 2008.
[8]M. Nowak, A. Antończak, P. Kozioł, and K. Abramski, "Laser prototyping of printed circuit boards," Opto-Electronics Review, vol. 21, no. 3, pp. 320-325, 2013.
[9]A. Alwaidh, M. Sharp, and P. French, "Laser processing of rigid and flexible PCBs," Optics and Lasers in Engineering, vol. 58, pp. 109-113, 2014.
[10]P.-Y. Cheng, W.-T. Hsiao, C.-K. Chung, S.-F. Tseng, and I.-C. Liao, "Laser direct imaging of transparent indium tin oxide electrodes using high speed stitching techniques," Optical Review, vol. 21, no. 5, pp. 732-735, 2014.
[11]K. Ryoo, M. Kim, J. Sung, K. Kim, and M. Kang, "Maskless laser direct imaging lithography using a 355-nm UV light source in manufacturing of flexible fine dies," Journal of Mechanical Science and Technology, vol. 29, no. 1, pp. 365-370, 2015.
[12]Rothenbach, Christian A., and Mool C. Gupta. "High resolution, low cost laser lithography using a Blu-ray optical head assembly." Optics and Lasers in Engineering 50.6 (2012): 900-904.
[13]Hansotte, Eric J., Edward C. Carignan, and W. Dan Meisburger. "High speed maskless lithography of printed circuit boards using digital micromirrors." Emerging Digital Micromirror Device Based Systems and Applications III. Vol. 7932. International Society for Optics and Photonics, 2011.
[14]Gao, Yiqing, et al. "Research on high-quality projecting reduction lithography system based on digital mask technique." Optik-International Journal for Light and Electron Optics 116.7 (2005): 303-310.
[15]Ryoo, Hoonchul, Dong Won Kang, and Jae W. Hahn. "Analysis of the line pattern width and exposure efficiency in maskless lithography using a digital micromirror device." Microelectronic Engineering 88.10 (2011): 3145-3149.
[16]C. Pfeiffer, X. Xu, S. R. Forrest, and A. Grbic, "Direct Transfer Patterning of Electrically Small Antennas onto Three‐Dimensionally Contoured Substrates," Advanced Materials, vol. 24, pp. 1166-1170, 2012.
[17]J.-H. Noh, I. Kim, S. H. Park, J. Jo, D. S. Kim, and T.-M. Lee, "A study on the enhancement of printing location accuracy in a roll-to-roll gravure offset printing system," The International Journal of Advanced Manufacturing Technology, vol. 68, pp. 1147-1153, 2013.
[18]Barraclough, William D., et al. "High-density interconnect technique." U.S. Patent No. 5,429,510. 4 Jul. 1995.
[19]Lynch, Thomas M. "High density interconnect system." U.S. Patent No. 4,838,800. 13 Jun. 1989.
[20]台灣PCB產業技術發展藍圖(2017-2021版)
[21]特刊Emerging Technology，工研院出版
[22]Pedrotti,L.,2008, “Basic Geometrical Optics,” Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, accessed Dec. 5, 2017,
[23]Taylor, Henry F., and Amnon Yariv. "Guided wave optics." Proceedings of the IEEE 62.8 (1974): 1044-1060.
[24]Born, Max; Wolf, Emil, Principles of Optics: Electromagnetic Theory of Propagation, Interference and Diffraction of Light (7th Edition) (Hardcover), Cambridge University Press, October 13, 1999.
[25]Bekefi, George; Barrett, Alan. Electromagnetic vibrations, waves, and radiation 2nd, illustrated. MIT Press. 1977.
[26]Hecht, Eugene, Optics 4th, United States of America: Addison Wesley, 2002.
[27]郭永康，光學，高等教育出版社
[28]趙凱華，新概念物理教程·光學.，高等教育出版社
[29]Kweon, G., and C. Kim. "Aspherical lens design by using a numerical analysis." JOURNAL-KOREAN PHYSICAL SOCIETY51.1 (2007)
[30]Forbes, Greg (2007). "Shape specification for axially symmetric optical surfaces". Opt. Express.
[31]Suzuki, Norikazu, et al. "Elliptical vibration cutting of tungsten alloy molds for optical glass parts." CIRP annals 56.1 (2007): 127-130.
[32]Zhou, Tianfeng, et al. "Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process." Journal of materials processing technology 209.9 (2009): 4484-4489.
[33]Hughes-Hallett, Deborah; McCallum, William G.; Gleason, Andrew M. Calculus : Single and Multivariable 6. John wiley. 2013
[34] Normal Distribution, Gale Encyclopedia of Psychology
[35] D.Richards Advanced Mathematical Methods with Maple,Cambridge 2002.[36] Kendell A. Atkinson (1988). An Introduction to Numerical Analysis (2nd ed.), Chapter 3. John Wiley and Sons.
[37] Hardy, G. H., Divergent Series, Oxford University Press, 1949.
[38] Ariga, Tatsuya, et al. "High-power pulsed CO 2 laser for EUV lithography." Emerging Lithographic Technologies X. Vol. 6151. International Society for Optics and Photonics, 2006.
[39] Horne, James H., and Sallie L. Baliunas. "A prescription for period analysis of unevenly sampled time series." The Astrophysical Journal 302 (1986): 757-763.
[40] Boersma, Paul. "Accurate short-term analysis of the fundamental frequency and the harmonics-to-noise ratio of a sampled sound." Proceedings of the institute of phonetic sciences. Vol. 17. No. 1193. 1993