由於整流二極體產品趨近成熟且技術層次不高，不同於其他半導體產業，二極體產業的進入門檻相對的低了許多。雖然二極體市場需求穩定，然而近年來由於製造二極體原物料－多晶矽與銅、鎳等基本金屬價格不斷提高，使得二極體產業的利潤受到嚴重侵蝕，經營環境愈加險峻。因此，良率與品質成為業者維持競爭力的不二法門。
六標準差品質系統是透過系統化方式進行不間斷的品質改善活動以達成卓越經營的目的。本個案研究是模擬應用六標準差的方式來解決某二極體專業製造商在平面黏著式整流器(SMD)生產上所面臨的銲接面覆蓋不良的問題。這個公司在了解顧客需求與品質關鍵特性後，試圖透過六標準差的方式進行問題改善活動並藉此評估六標準差品質系統的可行性。界定、衡量、分析、改善、控制(DMAIC)的手法被用來降低這個潛在問題的製程變異度與高缺陷率。本研究探討了這個公司如何以有系統、有紀律的方式朝著達成六標準差的目標邁進。研究結果顯示應用六標準差品質系統的方法確實有效提升了SMD產品的銲接面覆蓋率，製程能力Cpk值從0.73提升到1.39的水準。

Unlike the other Semiconductor business, Diode manufacturing technology of nowadays is much more mature, therefore the threshold of being a player in this industry is relatively lower. Though the market demand is stable, unfortunately the margin is severely eroded due to the price hiking of base material, polycrystalline silicon and other base metal, which are used for diode manufacturing. Hence, the manufacturing quality and cost are the name of the game for the diode makers to assure competitiveness and survival.
Six Sigma is a systematic methodology for continuous quality improvement and for achieving operational excellence. This paper deals with the application of Six Sigma based methodology in improving SMD soldering coverage problem in a diode manufacturing company. By realizing the customer’s expectation and understanding the critical to quality (CTQ) variables of the soldering process for SMD production, this company starts evaluating the feasibility to using Six Sigma for problem solving. The DMAIC (Define, Measure, Analyze, Improve, and Control) approach has been followed here to solve an underlying problem of reducing process variation and the associated poor process yield in meeting customer’s satisfaction. This paper explores also how a foundry can use a systematic and disciplined approach to move towards the goal of Six Sigma quality level. The application of the Six Sigma methodology resulted in a reduction of the solder void percentage encountered in the SMD product and increased the process capability from 0.73 to 1.39.

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