由於半導體的快速的發展，使晶片的功能越多且越快，在晶片高速運作下必然是
會產生大量的熱量。而目前晶片的縮小化，對於晶片散熱仍然是一個重要的課題，大
量的熱量累積在一個晶片上或是晶片上的一個部分，這有可能導致晶片功能失效，而
使整個系統無法正常運作。
本研究實驗經過程式編輯運算，使其晶片溫度達到產品宣告溫度一致性，當然也
考量到當天溫度及濕度變化，會造成所謂誤差，而不同的參數數值範圍，所對應的產
品本身溫度也會跟著改變，透過輸入值最大數，讓晶片裡的暫存器給塞滿，不斷的在
計算迴圈數值，板子溫度也瞬間提升起來，直到溫度保持在一定溫度內平衡。
本研究提出散熱塊加上導熱矽膠片及導熱膏之組合實驗，期望能找出相對最佳的
散熱組合，同時也根據熱阻公式為核心的方向來研究。實驗中也驗證其公式的實用參
考性，在本研究實驗中也找出了散熱塊加上導熱膏最佳之組合，在散熱塊加上導熱膏
的組合上，發現到導熱係數高的散熱塊上是散熱效率，其中導熱係數 20.0W+麒麟型
銅散熱塊散熱效果表現最優異。這是一個重要的突破點，在未來期望以研究為基礎，
找出更為進階的晶片散熱的解。

Due to the rapid development of semiconductors, chips have become more
functional and faster. A tradeoff of increased functionality and speed is increased heat
generation. Heat dissipation is a challenge in chip miniaturization. Excessive heat
accumulation on a chip or part of a chip can potentially lead to malfunction and jeopardize
the entire system.
In this study, algorithmic computation was performed to ensure consistency in chip
temperature with the product temperature as declared. Daily variations in temperature and
humidity, which could introduce errors, were taken into account. Additionally, the
temperature of the product varied when different ranges of parameter values were applied.
By inputting the maximum values, the processor registers of the chip reached capacity and
continuously calculated loop values. This resulted in a rapid surge in the board temperature
until it stabilized within a certain range.
This study proposed an experimental combination of heat sinks, thermal pads, and
thermal paste. The purpose was to determine the optimal configuration for heat dissipation.
The experiment was based on a thermal resistance formula that was verified for practicality
during testing. The optimal combination was heat sinks with thermal paste. In particular,
heat sinks with a high thermal conductivity coefficient demonstrated superior heat
dissipation efficiency, with a Kirin copper heat sink featuring a thermal conductivity of
20.0W exhibiting the highest heat dissipation efficiency. This was a significant
breakthrough. Future studies should focus on developing advanced chip cooling solutions
on the basis of these findings.

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