本論文主要研究在多層電路設計中，因數位IC本身快速切換產生瞬時電流，進而在另一端的類比IC產生同步切換雜訊(Simultaneous Switching Noise, SSN)。此雜訊會在電源輸送網路(Power Delivery Network, PDN)中傳播，使整個系統電路的電源完整性（Power Integrity, PI）受到影響。而在論文中，首先改變互補開口諧振器(Complementary Split Ring Resonators, CSRRs)結構來增加電感值達到抑制更低頻電源雜訊的效果。接著，主要的多層印刷電路板(Multi-layer Printed Circuit Board)設計中心理念是透過非週期性的嵌入互補開口諧振器並且加入短路導孔(Shorting Via)分析via間距與數量的影響，最後調整此結構的板材厚度來達到較佳的抑制效果。另外，因為非週期性結構的關係，比傳統上的週期性EBG來得省面積省成本並且有更佳的電源雜訊抑制效果，在此架構中頻寬範圍從0.072GHz至10GHz以上皆抑制於-40dB以下。

This thesis mainly studies that in multi-layer circuit design, the factor-bit IC itself rapidly switches to generate instantaneous current, and then generates simultaneous switching noise (SSN) at the other end of the analog IC. This noise will propagate in the Power Delivery Network (PDN), which will affect the power integrity (PI) of the entire system circuit. In this thesis, firstly, the structure of complementary split-ring resonators (CSRRs) is changed to increase the inductance value to achieve the effect of suppressing lower frequency power supply noise. Next, the main multi-layer printed circuit board design center idea is to analyze the effect of via spacing and quantity by non-periodic embedded complementary split-ring resonators and adding shorting via, and finally adjust the plate thickness of the structure can achieve better suppression effect. In addition, because of the relationship of the non-periodic structure, it saves area and cost compared with the traditional periodic EBG and has a better power supply noise suppression effect. In this architecture, the bandwidth range from 0.072GHz to above 10GHz is suppressed below -40dB.

[1] M. S. Sharawi, “Practical issues in high speed PCB design,” IEEE Potentials, Vol. 23. No. 2, 24-27, Apr. /May 2004
[2] M. Swaminathan and A. Ege Engin, Power Integrity Modeling and Design for Semiconductors and Systems. Englewood Cliffs, NJ: Prentice-Hall, 2007. [3] J. Chen, T. H. Hubing, T. P. Van Doren and R. E. DuBroff, "Power bus isolation using power islands in printed circuit boards," in IEEE Transactions on Electromagnetic Compatibility, vol. 44, no. 2, pp. 373-380, May 2002. [4] Wei Cui, Jun Fan, Yong Ren, Hao Shi, J. L. Drewniak and R. E. DuBroff, "DC power-bus noise isolation with power-plane segmentation," in IEEE Transactions on Electromagnetic Compatibility, vol. 45, no. 2, pp. 436-443, May 2003. [5] Wen-Hua Tu and Kai Chang, "Compact second harmonic-suppressed bandstop and bandpass filters using open stubs," in IEEE Transactions on Microwave Theory and Techniques, vol. 54, no. 6, pp. 2497-2502, June 2006 [6] Jinwoo Choi, V. Govind and M. Swaminathan, "A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications," Proceedings. 2004 IEEE Radio and Wireless Conference (IEEE Cat. No.04TH8746), Atlanta, GA, 2004, pp. 243-246
[7] L. Raimondo, F. De Paulis and A. Orlandi, "A Simple and Efficient Design Procedure for Planar Electromagnetic Bandgap Structures on Printed Circuit Boards," in IEEE Transactions on Electromagnetic Compatibility, vol. 53, no. 2, pp. 482-490, May 2011. [8] Jong Hwa Kwon, Dong Uk Sim, Sang Il Kwak, Jae Hoon Yun and Jong Gwan Yook, "Partial EBG placement on PDN to effectively suppress simultaneous
51
switching noise," 2008 Electrical Design of Advanced Packaging and Systems Symposium, Seoul, 2008, pp. 89-92. [9] M. Zhang, Y. Li, C. Jia and L. Li, "Simultaneous Switching Noise Suppression in Printed Circuit Boards Using a Compact 3-D Cascaded Electromagnetic-Bandgap Structure," in IEEE Transactions on Microwave Theory and Techniques, vol. 55, no. 10, pp. 2200-2207, Oct. 2007. [10] F. De Paulis and A. Orlandi, "Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures," in IEEE Microwave and Wireless Components Letters, vol. 19, no. 9, pp. 554-556, Sept. 2009. [11] J. Pan, Y. Li, J. Lu and D. Jiang, "A novel power/ground structure by etching with complementary split ring resonators for wideband simultaneous switching noise suppression," 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Guilin, 2014, pp. 1-3. [12] C. Ning et al., "Notice of Retraction: A Novel Electromagnetic Bandgap Power Plane Etched With Multiring CSRRs for Suppressing Simultaneous Switching Noise," in IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 3, pp. 733-737, June 2018. [13] H. Zhu, J. Mao and J. Li, "Signal and power integrity analysis for the novel power plane of EBG structure in high-speed mixed signal systems," 2013 IEEE International Wireless Symposium (IWS), Beijing, 2013, pp. 1-4. [14] M. M. Bait-Suwailam and O. M. Ramahi, "Ultrawideband Mitigation of Simultaneous Switching Noise and EMI Reduction in High-Speed PCBs Using Complementary Split-Ring Resonators," in IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 2, pp. 389-396, April 2012. [15] L. D. Smith, R. E. Anderson, D. W. Forehand, T. J. Pelc and T. Roy, "Power distribution system design methodology and capacitor selection for modern
52
CMOS technology," in IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp. 284-291, Aug. 1999.
[16] [Online].Available:https://www.edn.com/design/pc-board/4437016/PDN-design-essentials-for-wideband-low-impedance.
[17] Madhavan Swaminathan; A. Ege Engin, Power Integrity Modeling and Design for Semiconductors and Systems-Chapter 2, Englewood Cliffs, NJ: Prentice-Hall, 2007.
[18] Joong-Ho Kim, Madhavan Swaminathan, “Modeling of Irregular Shaped Power Distribution Planes Using Transmission Matrix Method,” IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 24, NO. 3, AUGUST 2001.
[19] Jie Qin, Omar M. Ramahi, Victor Granatstein, “Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits,” IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp. 661–669, Aug. 2007.
[20] Mu-Shui Zhang, Yu-Shan Li, Chen Jia, Li-Ping Li, and Jian Pan, "A Double-Surface Electromagnetic Bandgap Structure With One Surface Embedded in Power Plane for Ultra-Wideband SSN Suppression," IEEE Microw. Wireless Compon. Lett. vol. 17, no. 10, pp. 646-648, Oct. 2007.
[21] T. Kamgaing; O. M. Ramahi, “Design and Modeling of High-Impedance Electromagnetic Surfaces for Switching Noise Suppression in Power Planes,” IEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479–489, Aug. 2007.
[22] Jianjie Li, Junfa Mao, Min Tang, “Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits,” IEEE Microw.Wireless Compon. Lett., vol. 21, no. 12, pp. 646–648, Dec. 2011. [23] H. Zhu, J. Li and J. Mao, "Ultra-Wideband Suppression of SSN Using Localized Topology With CSRRs and Embedded Capacitance in High-Speed Circuits,"
53
in IEEE Transactions on Microwave Theory and Techniques, vol. 61, no. 2, pp. 764-772, Feb. 2013.
[24] Christian Schuster, Distinguished Lecturer for the IEEE EMC Society 2012-13. [25] J. S. Pak, H. Kim, J. Lee and J. Kim, "Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model," in IEEE Transactions on Advanced Packaging, vol. 30, no. 1, pp. 73-85, Feb. 2007, doi: 10.1109/TADVP.2006.890210.
[26] B. D. Jarvis, “The effects of interconnections on high-speed logic circuits,” IEEE Trans. Electron. Comput., vol. 12, no. 5, pp. 476-487, Oct. 1963
[27] Z. L.Wang, O.Wada, Y. Toyota, and R. Koga, “Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes,” IEEE Trans. Electromagn. Compat., vol. 47, no. 1, pp. 2-9, Feb. 2005.
[28] Anatol I. Zverev, Handbook of Filter Synthesis, 2nd ed. New York:Wiley, 1998, pp. 26-30, 237-240.
[29] M. S. Sharawi, “Practical issues in high speed PCB design,” IEEE Potentials, vol. 23, no. 2, Apr.-May 2004, pp. 24-27.
[30] S. H. Hall, G. W. Hall, and J. A. McCall, High-Speed Digital System Design, A Handbook of Interconnect Theory and Design Practices, Hoboken, NJ: Wiley, 2000.
[31] S. B. Cohn, “Slotline on a dielectric substrate,” IEEE Trans. Microw. Theory Tech., vol. 17, no. 10, pp. 768-778, Oct. 1969.
[32] D. M. Pozar, Microwave Engineering, Revised edition. New York:Wiley, 2005.
[33] J.S. Hong and M. J. Lancaster, Microstrip Filters for RF / Microwave Applications, 2nd Edition. New York:Wiley, 2011.
54
[34] W.-H. Tu and K. Chang, “Compact microstrip bandstop filter using open stub and spurline,” IEEE Microw. Wireless Compon. Lett., 15, no. 4, pp. 268–270, Apr. 2005. [35] R. Marques, F. Mesa, J. Martel and F. Medina, "Comparative analysis of edge- and broadside- coupled split ring resonators for metamaterial design - theory and experiments," in IEEE Transactions on Antennas and Propagation, vol. 51, no. 10, pp. 2572-2581, Oct. 2003. [36] J. D. Baena et al., "Equivalent-circuit models for split-ring resonators and complementary split-ring resonators coupled to planar transmission lines," in IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 4, pp. 1451-1461, April 2005. [37] J. Pan, Y. Li, J. Lu, X. Liu and W. Zhao, "Wideband Simultaneous Switching Noise Isolation in Power/Ground Cavity Structure with Complementary Split Ring Resonators," 2014 7th International Conference on Intelligent Computation Technology and Automation, Changsha, 2014, pp. 894-897, doi: 10.1109/ICICTA.2014.214.
[38] S. L. Huh and M. Swaminathan, "A Design Technique for Embedded Electromagnetic Band Gap Structure in Load Board Applications," in IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 2, pp. 443-456, April 2012.
[39] Z. Yan, Y. Xiong, W. Yu and Y. Wang, "An Improved Miniaturized Three-Layer Embedded Electromagnetic Bandgap Structure," in IEEE Transactions on Antennas and Propagation, vol. 62, no. 5, pp. 2832-2837, May 2014. [40] S. Huh, M. Swaminathan and F. Muradali, "Design, modeling, and characterization of embedded electromagnetic band gap (EBG) structure," 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, San Jose, CA, 2008,
55
pp. 83-86. [41] Z. Shen, W. Wang, F. Liu and Z. Zhou, "Design, simulation and analysis of embedded Uni-planar compact electromagnetic band-gap structure," International Conference on Computational Problem-Solving, Lijiang, 2010, pp. 165-170. [42] F. de Paulis, L. Raimondo and A. Orlandi, "Impact of Shorting Vias Placement on Embedded Planar Electromagnetic BandGap Structures Within Multilayer Printed Circuit Boards," in IEEE Transactions on Microwave Theory and Techniques, vol. 58, no. 7, pp. 1867-1876, July 2010. [43] F. de Paulis, L. Raimondo and A. Orlandi, "Signal integrity analysis of embedded planar EBG Structures," 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, 2010, pp. 330-333.