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    1

    Topological Escape Routing for Package Substrate Design Planning

    2

    Wire-bond Finger Placement for FBGA Substrate Layout Design Automation
    • Department of Computer Science and Information Engineering /112/ Master
    • Author: Yu-En Lin Advisor: Yi-Yu Liu
    • Wire bonding is a traditional packaging technique that enables chip pins to transmit signals to bo…
    • Clicks: 178Downloads: 0
    • Full text public date 2024/11/29 (Intranet public)
    • Full text public date 2024/11/29 (Internet public)
    • Full text public date 2024/11/29 (National library)

    3

    Congestion-Aware Routing Demand Estimator for Package Substrate Early Design Evaluation

    4

    Integer Linear Programming Based Substrate Routing Framework for Fine Pitch Ball Grid Array Package

    5

    Optimization Heuristics for Grid-based Integer Linear Programming Package Substrate Router
    1