本研究主要在研製具有導熱性質之複合式塑膠平板，先以多孔質陽極氧化鋁法(Porous Anodic Aluminum, PAA)所製作出之多孔質奈米陶瓷模板與熱塑性塑膠平板以嵌入式射出成形製程結合。實驗中探討射出成形參數對複合式平板熱傳導係數的影響、比較PAA模板與塑膠表面性質的差異及複合式平板中塑膠結構的高度對結合強度的關係。實驗結果顯示使用高塑料溫度、高保壓壓力及高射出速度可得到較好的熱傳導係數，其中塑料溫度為影響熱傳導係數之主要因素。複合式PC及ABS平板成品熱傳導係數分別為4.1W/m℃和2.2 W/m℃，其熱傳導係數較PC及ABS平板提高約12倍及9倍；透過接觸角與拉伸實驗分析後發現，ABS塑料的接觸角比PC塑料較為接近PAA模板及鋁板，且其結合強度也較高，代表塑料與PAA模板結合強度與兩相表面性質有關。高塑料溫度可獲得較高的結合強度，其中ABS塑料所製成的複合式平板可得到較好的結合強度0.18 MPa，透過SEM觀察結合強度檢測的試片得知，高塑料溫度使塑料在PAA模板中有較高的結構高度，代表塑料與PAA模板的接觸面積增加可以有效提升結合強度。本研究之研究成果未來可應用於3C產品外殼，輔以協助熱傳遞。

This research is to develop a novel process with the porous anodic aluminum (PAA) to produce the nano-porous ceramic template and then combines with a thermoplastics plate by the quasi-inserted injection molding process. The composited polymer plate containing aluminum material on PAA template has the ability to enhance heat transfer capability of local heat source. Effects of injection molding parameters on the thermal conductivity coefficient of the composited polymer plate have been investigated with the height of polymer inside the PAA template by bonding strength tests Experimental results show that the higher melt temperature, packing pressure and injection velocity can acquire better thermal conductivity coefficient. The melt temperature is the more significant parameter. The thermal conductivity coefficient of composited PC and ABS plate are 4.1W/m℃, 2.2 W/m℃ separately. They are 12 and 9 time in contrast with only PC and ABS plate by injection molding. According to contact angle and tensile analysis, the contact angle of ABS is similar with that of PAA and it has higher bonding strength compared with that of PC. It means that the bonding strength of polymer and PAA template is related to their property of contact surface. The higher melt temperature can obtain the higher bonding strength. The composited ABS plate has the higher strength bonding as 0.18 MPa. According to SEM observation, the depth of polymer coated in PAA template is increased by higher melt temperature and it is contributed to the larger contact area of PAA and polymer. Result of this study can be applied to the conductive shell plate of 3C products to reduce heat damage in near future.

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