本文主要研究鈷─碳化矽瓷金複合電鍍微粒共沉積機構，觀察操作變數對鍍層微粒重量比例之影響，以期提高鍍層微粒重量比例及鍍層耐磨特性。並針對微粒上吸附離子還原之特性，提出以金屬離子和微粒沉積速率對鍍層微粒重量比率影響之新模式。由實驗與理論模式結果發現在低電流密度區域微粒沉積速率主要受其表面吸附之H+離子濃度影響，當其達吸附H+還原極限電流時，微粒沉積速率固定於某值。在高電流密度區域，微粒上吸附之H+離子及金屬離子之還原控制微粒沉積速率。最後微粒表面離子皆達極限電流區時，其沉積速率又達另一定值。而鍍層鈷金屬沉積速率與有效電流密度成正比，而與溶液中微粒濃度無關。由實驗結果求得模式中不同電流密度區域之常數，再由新模式預測鍍層微粒重量比率，其結果與實驗相當符合。

The model of the Co-SiC electro-codeposition was investigated. A new electro-codeposition model involving the deposition of particles and metallic ions was proposed. Effects of the current density, the particle loading, the stirring rate and pH value on the percent weight of partcle on the composite coating and the polarization curve were also studied.

The resuits indicated that the rate of particle deposition was controlled only by the reduction of the adsorbed H+ ions on particle surface at low current density. When the current density is high, the rate of particle deposition was governed by reduction of both the adsorbed H+ ions and Co+2 ions on particle surface. The metallic deposition rates increased linearly with the current density but were independent of the particle loading. The weight percent of particle on the composite coating can be predicted by the proposed model. The experimental results are consistent with the prediction of the proposed model.

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