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研究生： 楊巧詣
Chiao-Yi Yang
論文名稱： 銲墊表面處理層開發暨顯微組織分析
Surface finish engineering and microstructure analysis for solder joints
指導教授： 顏怡文
Yee-Wen Yen
莊鑫毅
Hsin-Yi Chuang
口試委員: 高振宏
Cheng-Heng Kao
陳志銘
Chih-Ming Chen
丘群
Chun Chiu
學位類別： 碩士
Master
系所名稱： 工程學院 - 材料科學與工程系
Department of Materials Science and Engineering
論文出版年： 2021
畢業學年度： 109
語文別： 中文
論文頁數： 117
中文關鍵詞： 覆晶製程 、表面處理 、有機保銲層(OSP) 、ENEPIG 、SAC銲料 、Innolot銲料
外文關鍵詞： Flip Chip(FC), Surface finish, Organic solderability protectant(OSP), ENEPIG, SAC solder, Innolot solder
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    • 摘要 III Abstract IV 誌謝 VI 目錄 VIII 圖目錄 X 表目錄 XIII 第一章、前言 1 第二章、文獻回顧 3 2-1 電子構裝技術 3 2-1.1 電子構裝簡介 3 2-1.2 覆晶製程之簡介 4 2-1.3 回銲技術 5 2-2 界面反應與擴散動力學 7 2-2.1 界面反應 7 2-2.2 擴散理論 8 2-3 界面反應相關文獻 10 2-3.1 經界面反應形成介金屬相之體積收縮 10 2-3.2 表面處理層 11 2-3.3 金脆現象 13 2-4 相平衡 15 2-4.1 Cu-Sn二元系統相平衡圖 16 2-4.2 Ni-Sn二元系統相平衡圖 18 2-4.3 Cu-Ni二元系統相平衡圖 19 2-4.4 Cu-Ni-Sn三元系統相平衡圖 19 2-4.5 Ag-Sn二元系統相平衡圖 21 2-4.6 Au-Sn、Pd-Sn二元系統相平衡圖 22 第三章、實驗方法 25 3-1 銲墊表面處理層之磁性材料結構最佳化 25 3-1.1 時效熱處理 25 3-1.2 回銲反應 26 3-1.3 冷熱循環測試 26 3-1.4 試片金相處理 26 3-1.5 界面觀察與分析 27 3.2 表面處理層暨銲料組成對介金屬相成長及元件可靠度影響評估 29 3-2.1 試片前處理 29 3-2.2 試片金相處理 30 3-2.3 界面觀察與分析 30 第四章、結果與討論 32 4-1 銲墊表面處理層之磁性材料結構最佳化 32 4-1.1 樣品對照組 32 4-1.2 150°C時效熱處理之界面反應 35 4-1.3 180°C時效熱處理之界面反應 44 4-1.4 200°C時效熱處理之界面反應 52 4-1.5 回銲試驗之界面反應 60 4-1.6 冷熱循環測試 67 4-1.7 比較樣品可靠度 73 4-2 表面處理層暨銲料組成對介金屬相成長及元件可靠度影響評估 75 4-2.1 顯微結構及相組成 75 第五章、結論 81 參考文獻 82 附錄 86

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