本研究利用分析個案S公司及台灣在3D立體堆疊封裝運用與未來發展領域中的競爭策略與機會。主要探討半導體封裝代工產業中3D立體堆疊封裝技術發展整合的策略個案。3D立體堆疊封裝技術發展，在歷經2004-2010快速成長後，也因市場的需求大增需求不斷的成長，市場的競爭趨勢已從單純從封裝成面的經濟規模，逐漸走向服務及技術整合能力的對決。個案公司在這場競爭賽局中，藉由如何瞭解3D立體堆疊封裝技術的發展特性與使用者的期待，成功找出核心能力的轉型要素，以能持續保有及擴張封裝代工的市佔率。
針對個案的S公司的3D立體堆疊封裝技術運在未來發展，本研究得到下列的結論，可作為個案公司在未來策略的制定及執行面的方針包括，第一、即時的線上客服與技術支援答覆；第二、更快速有效的技術性完整的支援服務；第三、更完整的產品整合運用及客戶合作服務項目。
本研究個案公司在3D立體堆疊封裝技術未來發展，也提出以下各點建議第一、更有效的模組化整合消費性電子產品封裝規格；第二、積極的搶佔進入汽車電子供應鏈；第三、積極拓展客製化服務範圍與高階高技術封裝代工。
由3D立體堆疊技術與未來的成長性與發展性，本研究發現3D立體堆疊封裝技術將是電子相關產品及消費性電子產品未來發展的主軸。因此像個案的S公司在整個推動策略執行過程中必須充分了解自己的技術能力與市場的期待，這樣才能長久維繫領導廠商的地位，次及提供企業成長的主要動能。

This study analyzes competitive strategy and opportunity of company S and future application of Taiwan’s integrated stack package of 3D-IC chip to investigate the technical development of 3D-IC chip in the integration of package and testing of semiconductor industries using a strategic case study. The technical development of 3D-IC chip, after a rapid boost during 2004 to 2010, grows up quickly for requirement from the market. The strategic trend of economies of scale in package industries has transferred into competition of service and integrated techniques. The case study verifies the way to understand the feature of technical development in the integrated stack package of 3D-IC chip and users’ expectation for the case company to find out key factor of transforming capability, as well as retain and expand market share among package subcontractors.

As for the future technical development of the integrated stack package of 3D-IC chip, this study concludes the future strategy and implement for company S as follows: 1. Real time on-line customer service and responsive technical support; 2. Even more rapid and effective whole technical support service; 3. More complete application of integrated products and cooperative customer service items.

Concerning the technical development of case company in the integrated stack package of 3D-IC chip, this study demonstrates suggestions as follows: 1. Integrated modular for packaging specification of customer electronics; 2. Aggressive seizing and entering automotive supply chain; 3. Actively expand the field of customized service and become a high level of technical package subcontractor.

Regarding the growth and future technical development of the integrated stack package of 3D-IC chip, this study clarifies the integrated stack package of 3D-IC chip is going to be the principal axis of electronic related products and customer electronics. As a result, company S has to understand its own technical capability and expectation from the market so as to sustain the leadership and velocity of enterprise growth, when implementing competitive strategy.

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