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研究生: 黃秀隆
Hsiu-Lung Huang
論文名稱: 印刷電路板粉應用於水泥砂漿之工程性質探討
The Study on Using PCB Powder Incorporated with Cement Mortar
指導教授: 黃兆龍
Chao-Lung Hwang
口試委員: 林凱隆
Kae-Long Lin
蘇南
Nan Su
王和源
Her-Yung Wang
陳君弢
Chun-Tao Chen
學位類別: 博士
Doctor
系所名稱: 工程學院 - 營建工程系
Department of Civil and Construction Engineering
論文出版年: 2015
畢業學年度: 103
語文別: 中文
論文頁數: 79
中文關鍵詞: 玻璃纖維PCB粉末水泥砂漿再生利用
外文關鍵詞: Glass Fiber, PCB Powder, Cement Mortar, Reuse
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本研究主要探討廢PCB板中玻璃纖維粉與樹脂粉取代細粒料(天然河砂)以固化於水泥砂漿,主要目的為促進此種廢棄物再利用於以水泥為基底之材料中,達到資源再生利用之可行途徑,並且符合綠色建材之研發方向。經取得破碎PCB板之玻璃纖維,外觀呈短籤形狀之破斷外形,長度小於6 mm、樹脂粉為細顆粒,兩者粒徑分布均有很大的變異,但95%以上通過#16篩。考慮添加於水泥砂漿的資源化前提下,以取代砂方式施行,以固定體積取代砂之配比,配比設計以標準砂漿重量比(砂:水泥:水=2.75:1:0.485)為依據作為對照組之條件下,測試水泥砂漿之新拌與硬固性質。研究結果顯示;玻璃纖維粉及樹脂粉取代超過5%時,水灰此0.485之流度值驟減180mm以下,適於不具垂流之場合。至於硬固力學之測試結果,抗壓強度增加量不顯著,但抗彎強度皆高於標準水泥砂漿,另外乾縮裂縫將隨取代砂量的增加而減少,顯示廢PCB板之玻璃纖維可適量使用於水泥砂漿之中(建議2%以下),提供此工業廢棄物再利用的另一合理應用途徑。


This study focused on the use of glass fiber of waste PCB powder to replace fine aggregate (natural sand) and realize the toxicity characteristics of cement mortar. The main purpose is to promote the re-use of such waste with cement as the basic material to achieve the feasible way of the use of renewable resources, in line with the development of green building materials. The glass fibers were made from the broken PCB board, with the average length less than 6 mm. In this study, cement mortar with PCB powder was added to replace sand with the fixed mix proportion ratio (sand: cement: water = 2.75: 1: 0.485) as the base of the control group. The fresh and hardened properties were studied to reveal their performance. The result of this study is that when the addition of glass fiber is more than 5%, the flowability of specimens with water-to-cement ratio of 0.485 were dropped suddenly down to 180 mm. The results indicate that the compressive strength has not significantly improved; however the bending strength was higher than the standard cement mortar. In addition, the shrinkage cracks of sand-replaced specimens were reduced. These results showed that waste PCB powder and glass fiber could be used in the cement paste mortar (recommendation for less than 2%), which can provide another way to the re-use of such industrial waste.

目錄 論文摘要 I ABSTRACT II 誌 謝 III 目錄 IV 表目錄 VI 圖目錄 VII 第一章 緒論 1 1.1 研究動機 1 1.2 研究目的 2 1.3研究限制 2 1.4 預期成果與貢獻 2 第二章 文獻回顧 3 2.1 廢電器 3 2.2 廢電路板 3 2.3 廢電路板資源化 4 第三章 實驗計畫 7 3.1 儀器設備 7 3.2 試驗規範與方法 9 3.3 配比設計 15 第四章 印刷電路板粉物性分析 20 4.1 印刷電路板粉之物理性質測試 20 4.2 印刷電路板粉之化學成分分析 22 4.3 印刷電路板粉之毒性特性溶出程序(TCLP) 22 4.4 微觀結構分析 22 第伍章 工程性質分析 29 5.1 新拌性質 29 5.2 硬固性質試驗 30 5.2.1抗壓強度 30 5.2.2 抗彎強度 30 5.2.3 體積穩定性 31 5.2.4耐久性 33 5.3微觀結構 35 5.3.1 微裂縫 35 5.3.2各配比之晶相結構 35 5.4毒性特性溶出程序 36 第六章 結論與建議 71 6.1結論 71 6.2 建議 72 參考文獻 73

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