本論文係針對高速與高頻訊號連接需求，提出三款可應用於下世代網路與通訊裝置之連接器。第一部分提出一款符合USB4 Gen3規範標準之USB Type-C高速連接器，其中主要透過修改內部屏蔽結構，來改善其訊號完整度問題，以實現高品質訊號傳輸，其雙通道高速資料傳輸速率可望達到40 Gbps，來應用於消費性電子產品。第二部分提出一款搭配超低損耗纜線之可旋轉式射頻線對板連接器，其嵌合高度為1.4 mm，操作頻率可涵蓋DC至60 GHz，並且由於搭配超低損耗纜線，有利於改善毫米波路徑損失問題，提供一種可旋轉式新型毫米波低損耗連接方案，可應用於5G毫米波行動裝置與基地台、雷達系統、衛星模組等。第三部分提出一款微型超寬頻線對板連接器，其嵌合高度僅為0.7 mm，且頻率涵蓋範圍可由DC至150 GHz，可應用於下世代毫米波與次太赫茲裝置之高頻訊號連接。

This thesis proposes three kinds of the high speed and high frequency connectors to be applied in next generation network and communication devices for signal connection requirements. First, an USB type-C high speed connector is designed, where signal integrities are improved mainly by modifying internal shielding structures. Thus, the specifications of the USB4 Gen3 can be satisfied and a dual-channel data rate of 40 Gbps can be achieved for consumer electronic products. In the second part, a rotary RF wire-to-board connector with an ultra-low loss cable is developed to reduce interconnection loss at mmWave frequencies. A new type of the rotary connector structure with a mating height of 1.4 mm is designed to achieve a bandwidth from DC to 60 GHz. This rotary type RF wire-to-board connector may provide ultra-low loss connection solutions for 5G mobile devices and base stations, radar systems, satellite modules, etc. Finally, a miniaturized and ultra-wideband wire-to-board connector is proposed, which has a mating height of only 0.7 mm and may achieve a bandwidth from DC to 150GHz. This RF wire-to-board connector may provide high frequency signal connection solutions for next generation mmWave and sub-terahertz devices.

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