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研究生: 黃堯弘
Yao-Hong Huang
論文名稱: 電泳沉積輔助線鋸切割於矽基板加工之永續性分析之研究
Wire Sawing with Electrophoresis Deposition of Grits for Sustainable Manufacturing of Silicon Substrates
指導教授: 陳炤彰
Chao-Chang Chen
口試委員: 鍾俊輝
Chun-Hui Chung
李碩仁
Shuo-Jen Lee
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2012
畢業學年度: 100
語文別: 中文
論文頁數: 212
中文關鍵詞: 線鋸切割電泳沉積永續製造生命週期評估太陽能電
外文關鍵詞: Wire sawing process, Electrophoresis deposition, Life cycle assessment (LCA), Sustainable manufacturing, Solar cell
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  • 太陽能為目前最為受到重視之替代能源之一,目前在太陽能電池中主要可分為矽基板太陽能電池和薄膜型太陽電池,目前主要使用的仍以矽基板太陽能電池為主,本研究主要為改進目前切割矽基板之線鋸切削製程,發展一新型之線鋸切割製程,本研究主要利用電動力技術中之電泳沉積(Electrophoresis Deposition)技術來輔助線鋸切割,實現一電泳沉積輔助線鋸切割製程(Wire Sawing with Electrophoresis Deposition of Grits, WSEPD),以達到減少漿料之使用量和控制鋼線上之漿料膜厚之厚度,以達到降低切口損失(Kerf Loss)之目的,且本研究也同時探討線鋸製程對於整體太陽能電池基板生產之永續製造(Sustainable Manufacturing)之概念,導入生命週期評估(Life-Cycle Assessment, LCA)之概念,評估分析線鋸製程中漿料使用量對環境之衝擊,根據實驗結果,WSEPD在切口損失上為145μm,相對漿料使用量上可減少85.7%之載液用量和40%之磨料之用量,並減低38.9%之二氧化碳排放量,本研究之相關成果可供日後於薄型化矽基板切割技術和永續製造之所需製程發展之參考。


    Wire sawing process is an important process of the fabrication of silicon substrates for application of solar cells. Currently, two methods including free abrasive and fixed abrasive method have been popularly adopted in related industry. The free abrasive or slurry wire sawing (SWS) has low abrasive working efficiency. The fixed abrasive wire sawing or diamond wire sawing (DWS) has high cost. Though the solar cell is claimed as a green energy product, fabrication of solar cell currently depends on some processes that are not fit to sustainable manufacturing. This research is to develop a novel wire sawing with electrophoresis deposition of grits (WSEPD) that can attract and deposit abrasive grits on the wire and then to improve the wire sawing efficiency. Different parameters of electrophoresis deposition have been tested and discussed in such wire sawing process. Life cycle assessment (LCA) has also proceeded in this study, focusing on slurry consumption and the environmental impact. Results of experiments have verified the developed WSEPD that can reduce the slurry consumption and improve the wire sawing efficiency. The WSEPD can be applied on the multi-wire sawing for sustainable manufacturing process of silicon substrates in the near future.

    摘要 I Abstract II 致謝 III 目錄 IV 圖目錄 IX 表目錄 XVIII 符號表 XXII 第一章 緒論 1 1-1 研究背景 1 1-2 線鋸製程介紹 4 1-3 研究動機與目的 7 第二章 文獻回顧 10 2-1 硬脆材料破壞機制之文獻回顧 10 2-2 複線式線鋸切割製程之文獻回顧 16 2-3 非機械式之硬脆材料切割製程之文獻回顧 26 2-4 電泳沉積技術之文獻回顧 32 2-5 線鋸切割製程之專利分析 36 2-6 電泳沉積技術之專利分析 39 2-7 文獻回顧總結 42 第三章 電泳沉積理論及永續製造 51 3-1 電動力效應(Electrokinetic Phenomenon)之理論介紹 51 3-1-1 電雙層(Electric Double Layer ,EDL) 52 3-1-2 電滲現象(Electro-osmosis Phenomenon) 54 3-1-3 電泳現象(Electrophoresis Phenomenon) 57 3-1-4 電泳沉積(Electrophoresis Deposition,EPD) 61 3-2 電泳沉積輔助線鋸切割 63 3-2-1 電泳沉積輔助線鋸切割製程介紹 63 3-2-2 電泳沉積動力學(Kinetic of Electrophoretic Deposition) 64 3-3 生命週期評估(Life-Cycle Assessment, LCA)理論介紹 68 3-3-1 目標與範圍之界定(Goal& Scope Definition) 69 3-3-2 生命週期存貨(Life-Cycle Inventory, LCI) 70 3-3-3 生命週期衝擊評估(Life-Cycle Impact Assessment, LCIA) 71 3-3-4 生命週期闡述(Life-Cycle Interpretation) 73 第四章 實驗規劃與方法 74 4-1複線式線鋸切割製程分析 74 4-2 實驗規劃 77 4-3 實驗設備 79 4-3-1 靜態電泳之測試夾具 79 4-3-2 動態電泳測試平台 79 4-3-3 電泳輔助線鋸切割機台 81 4-3-4 電源供應器 83 4-4 實驗耗材 84 4-4-1 多晶矽碇 84 4-4-2 碳化矽磨料 85 4-4-3 切割鋼線 86 4-4-4 分散劑 88 4-5 量測設備 91 4-5-1 掃描式電子顯微鏡 91 4-5-2 黏度計 92 4-5-3 Zeta potential量測儀 93 4-5-4 綠光干涉儀 93 4-5-5 精密電子天秤 94 4-5-6 壓力感測器 95 4-5-7 雷射粒徑分析儀 95 4-5-8 2.5D影像量測儀 96 4-5-9 雙束型發射聚焦離子束顯微鏡 97 第五章 實驗結果與討論 98 5-1 懸浮液之性質量測與分析 98 5-1-1 懸浮液於不同pH值下之Zeta potential之影響 99 5-1-2 懸浮液於不同pH值下對電泳沉積之影響 100 5-1-3 懸浮液於不同pH值下懸浮液穩定性之影響 102 5-2 靜態電泳沉積實驗 106 5-2-1 不同電壓下對靜態電泳沉積量之影響 107 5-2-2 不同時間下對靜態電泳沉積量之影響 113 5-3 動態電泳沉積實驗 119 5-3-1 不同電壓下對動態電泳沉積量之影響 120 5-3-2 不同時間下對動態電泳沉積量之影響 125 5-3-3 估算實際產線上之電泳槽大小 131 5-4 電泳輔助線鋸切割實驗 132 5-4-1 切口損失(Kerf Loss) 136 5-4-2 表面品質與形貌(Surface Topography) 140 5-4-3 弓角(Wire Bow)變化和Z軸力量量測分析 154 5-5評估漿料於線鋸製程中之環境衝擊 165 5-5-1 線鋸製程之生命週期存貨(Life –Cycle Inventory,LCI) 166 5-5-2 漿料使用量於線鋸製程上之碳足跡和成本之估算 168 第六章 結論與建議 172 6-1 結論 172 6-2 建議 173 參考文獻 175 附錄A 不同pH值下之Zeta Potential 184 附錄B 不同pH值下之SEM圖 195 附錄C 不同pH值下之懸浮液沉澱情況 196 附錄D 靜態電泳沉積下之SEM圖 199 附錄E 動態電泳沉積下之SEM圖 201 附錄F 不同濃度下之沉積量與厚度 203 附錄G 不同時間下之弓角變化 205 作者簡介 211

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