現今對軟性和可穿戴式電子元件的需求不斷的增長，材料是必須要能耐受應力。儘管有機材料具有較高的容忍性，但然而，完全π共軛的半導體材料因其剛性與較差的抵抗性，使得在循環的載荷條件下材料的機械故障是不可避免的而導致裂紋的擴展。為了解決這類的問題，我們提出了一種具有抗撕裂性和室溫下可自我修復的半導體複合材料，該複合材料是透過物理混合共軛高分子與丁基橡膠彈性體而組成。這種新的複合材料展現出創紀錄的低彈性模量(<1 MPa)和超高的變形能力，其斷裂應變超過800%。此外，僅需通過將兩個單獨薄膜透過簡單地物理接觸，及可的物理接觸展現了在室溫下的自動自我修復，其中包含的機械性質和電性。由於大大提高了對氧氣和水的阻隔性能，該複合材料還顯示出超過五個月的長效元件大氣穩定性。另一方面，丁基橡膠廣泛適用於各種P型和N型半導體聚合物，用於製造可自我修復的電子器件，從而提供可模仿人類皮膚的抗撕裂性和可自我修復特性的新型彈性電子器件。

Nowadays the demands for soft and wearable electronic are increasing, material can afford strain must need. Although organic materials have better tolerance, but the mechanical failure of fully π-conjugated semiconducting materials are unavoidable under cyclic loading conditions, due to their rigid properties and poor resistance leading crack propagation. To solve this problem, we present a tear-resistant and room-temperature self-healable semiconducting composite, consisting with conjugated polymers and butyl rubber elastomers by physical blending. This new composite demonstrated record-low elastic modulus (< 1 MPa) and ultra-high deformability with fracture strain above 800%. Furthermore, only easily physical contact of two separate films that can autonomous self-healing at room temperature, both mechanical and electronic. Besides, the composite film also exhibits long-term device stability in the ambient environment over five months due to much-improved barrier property to both oxygen and water. On the other hand, Butyl rubber is broadly applicable to various P-type and N-type semiconducting polymers for fabricating self-healable electronics to provide new resilient electronics that mimic the tear resistance and healable property of human skin.

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