銲料在電子構裝中扮演著相當重要的角色，主要使用於電子元件與其電路板之間的連接，並能傳遞其訊息。因先前文獻多半單獨研究無鉛銲料與 Cu 金屬之界面反應，為了與文獻研究相比較以及兼顧前瞻性，本研究致力於Sn-0.7 wt.% Cu (SC) 和 Sn-9 wt.% Zn (SZ) 兩種無鉛銲料與 Cu-Ti 合金 (C1990) 之相關反應，另外添加 Ti 增加其合金的可銲性，藉此探討界面中生成金屬間化合物 (intermetallic compound，IMC) 的機制與生長動力學。
利用掃描電子顯微鏡 (SEM) 、能量散射能譜儀 (EDS) 等顯微儀器觀察界面處所生成介金屬相的顯微結構。 Cu-Ti 合金 (C1990) 分別與無鉛銲料 Sn-9Zn 及 Sn-0.7Cu 控制溫度在 240 ˚C 、 255 ˚C 和 270 ˚C 下進行反應，以及提調控時間參數 0.5 、 1 、 2 、 4 和 5 小時，實驗結果發現 SZ/C1990 界面中會生成 CuZn5 和 Cu5Zn8 ，且 SC/C1990 界面中皆生成 Cu6Sn5 ，所生成相的厚度皆隨著反應時間和溫度的增加而變厚，兩種無鉛銲料與 Cu-Ti 合金進行的反應皆符合拋物線定律，表明本實驗研究的 IMC 反應受擴散控制。最後可推算出 SZ/C1990 所得的活化能為 33 kJ/mole ，而 SC/C1990 反應所得的活化能為 93 kJ/mole 。

The solders play an important part in the electronic construction. It mainly connect with electronic component and circuit board, and transfer it message. The researches talked about interfacial reactions between Sn-0.7Cu (SC) and Sn-9Zn (SZ) solders and Cu react. To compare the previous literature and the researches are forward-looking. This researches are Sn-0.7Cu (SC) and Sn-9Zn (SZ) solders and Cu-Ti alloy (C1990) react. In order to improve the alloy reliability, the Ti add into the copper-based substrates. The report explore the interface are generated mechanism of the IMCs (intermetallic compounds) and growth kinetics.
This experiment microscopically observes interfacial IMC phases by means of various microstructure experiment with microscopy instruments such as SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), and etc. Cu-Ti alloy and Sn-9Zn, Sn-0.7Cu solders react at 240, 255, and 270 °C for 0.5, 1, 2, 4, and 5 h. The results discover SZ/C1990 interface are generated CuZn5 and Cu5Zn8. SC/C1990 interface is all generated Cu6Sn5. The thickness of the IMCs layer increase when the reaction time and temperature increase. The two lead-free solders and Cu-Ti alloy reactions conform the parabolic law. The reaction of the IMC are diffusion control. Finally the activation energy of SZ/C1990 is calculated to be 33 kJ/mole, and the activation energy of SC/C1990 is calculated to be 93 kJ/mole.

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