本研究以條紋投影輪廓技術為基礎，開發覆晶封裝錫球凸點進行高度量測系統。首先，提出新穎的單應性條紋校正技術。投影影像的座標和相機擷取影像座標間平面的單應性關係，用於在擷取影像平面上產生條紋影像。然後將影像轉換並投影到投影平面上，可有效地減少由條紋週期不一致所引起的相位誤差。然後針對彩色3CCD相機具有彩色混疊效應之問題，使用彩色混疊係數校正技術於抑制彩色3CCD相機中的彩色混疊效應。以及本研究提出各通道編入不同條紋基準值與振幅強度之條紋相位資訊，產生具有強健性之彩色複合條紋。並提出多通道複合相位解纏繞演算法，透過各通道的條紋振幅權重來進行不同通道相位資訊複合，提升物件高度的量測精度與量測穩定性。
實驗結果可知，本研究所提出之方法，量測50 μm高度平面，系統平均量測精度為0.43 μm，標準差1.38 μm。結果證明，本研究所提出的三維測量系統可有效地量測50 μm之高度平面。在覆晶封裝錫球凸點測量實驗中，分析彩色亮度響應，求得條紋基準值與振幅強度參數產生條紋，以克服覆晶封裝基板和錫球凸點之間的反射係數問題。本研究所提出的系統在焊料凸點測量中具有良好的測量結果和穩健的穩定性，並且可用於量測微米級的覆晶封裝錫球凸點之高度量測應用。

This study developed a flip-chip solder bump height measurement system based on fringe projection profilometry technology. First, this study proposed a novel method of homography fringe generation, using the planar homography relationship between the coordinates of the projected image and the camera-captured coordinates to generate a fringe image on the captured image plane. The image was then converted and projected onto the projection plane to obtain a corrected fringe image of periodic consistency, thus effectively reducing phase errors caused by an inconsistent period. Second, the study used the color crosstalk coefficient correction technique to suppress the color cross-talk effect in the color 3CCD camera. Third, this study proposed fringes with different base values and modulation intensities in color channels, in order to produce a color composite fringe with robustness, and set up a multi-channel composite phase unwrapping algorithm that uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability.
The experimental results showed that the average measurement accuracy is 0.43 μm and the standard deviation is 1.38 µm. The results thus proved that the proposed height measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe parameter-based values and amplitude intensity parameters were analyzed to overcome the problem of the reflective coefficient between the flip-chip baseboard and the solder bump. The proposed system presents good measurement results and robust stability in the solder bump measurement and can be used for the measurement of height information for micron flip-chip solder bump application.

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