本研究以In/Ni/Cu/Ni/In 多層結構與Sn/Cu 基材進行200、240 與
300oC 下迴焊接合2 小時後，並在100oC 下進行50~1500 小時的時效
熱處理，希望利用此種結構能夠取代高溫錫-鉛銲料並兼顧可靠度與
環保之需求。研究結果顯示此三種溫度系統下此多層結構與Sn/Cu 基
材界面處皆會生成(Cu,Ni)6(Sn,In)5 相與Cu2In3Sn 三元介金屬相。迴焊
溫度200oC 時，在靠近鎳層處會有一平整(Ni,Cu)3(Sn,In)4 相的生成；
而300oC 系統在靠近銅基材端會有一平整Cu3(Sn,In)相的生成，且
(Cu,Ni)6(Sn,In)5 與Cu3(Sn,In)相在接合界面中會佔大多數。各系統生
成的介金屬相在經過時效時間增長並不會有任何改變，但200 與
240oC 的系統中兩介金屬相Cu2In3Sn 與(Cu,Ni)6(Sn,In)5 之所占區域比
值會隨之增加；而300oC 之系統Cu3(Sn,In)相亦會隨之增厚，且此相
的成長機制是由擴散控制。在機械強度測試方面，300oC 之系統機械
強度最為優良。綜觀實驗結果In/Ni/Cu/Ni/In 多層結構在迴焊300oC
時，在界面處大多會生成高熔點的介金屬相，且在機械強度方面又較
其他兩個系統來的優良，故認定本研究在此系統下，此多層結構最適
合用來取代高溫錫鉛銲料的選擇。

In this study, the multi-layer structure (In/Ni/Cu/Ni/In) and Sn/Cu
substrate reflowing at 200, 240 and 300oC for 2 h, then aging at 100oC for
50-100 h. Hoping to use this structure to replace the high-temperature
Sn-Pb solders and achieve both reliability and environmental protection
requirements. The results showed the all systems were formed the
(Cu,Ni)6(Sn,In)5 phase and Cu2In3Sn phase at interface. In the 200oC
system, it formed a planar layer (Ni,Cu)3(Sn,In)4 near Ni layer; In the
300oC system, it formed a planar layer Cu3(Sn,In) near Cu substrate, and
most of them were (Cu,Ni)6(Sn,In)5 and Cu3(Sn,In) two phases. All
systems formed IMCs don’t change with increasing aging time. But in the
systems which were reflowed at 200 and 240oC, Cu2In3Sn and
(Cu,Ni)6(Sn,In)5 phases of the occupied area ratio were increased; In the
system which was reflowed at 300oC, Cu3(Sn,In) phase was growth with
increasing aging time, and the growth mechanism is controlled by
diffusion. In the mechanical strength testing, the reflowed at 300oC
system is the most excellent. From all the results, this study finds that
under the reflowed at 300oC system, this multi-layer structure is most
suitable choice to replace high-temperature Sn-Pb solder.

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