研究生: |
張立昇 Li-Sen Chang |
---|---|
論文名稱: |
無線通訊微型晶片天線之設計 Tiny Chip Antenna Designs for Wireless Communications |
指導教授: |
楊成發
Chang-Fa Yang |
口試委員: |
王錫福
Sea-Fue Wang 胡泉凌 Chun-Ling Hu 林舜天 Shun-Tian Lin 鄭國忠 Kuo-Chung Cheng |
學位類別: |
碩士 Master |
系所名稱: |
電資學院 - 電機工程系 Department of Electrical Engineering |
論文出版年: | 2005 |
畢業學年度: | 93 |
語文別: | 中文 |
論文頁數: | 127 |
中文關鍵詞: | 筆記型電腦 、無線網路卡 、無線通訊 、晶片天線 |
外文關鍵詞: | Notebook, WLAN cards, Wireless Communication, Chip Antenna |
相關次數: | 點閱:434 下載:0 |
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本論文應用XFDTD時域有限差分套裝電磁模擬軟體來進行微小型晶片天線之設計與相關模擬分析,並採用嵌入射出成型技術來製作晶片天線,其中是先將天線導體線路製作在構裝體上,再使用介電複合材並以嵌入射出成型方式封裝此構裝體,來製造晶片天線。此套天線製程與一般常見的低溫共燒陶瓷晶片天線製程相比,乃具有技術門檻較低、製作成本較少、天線設計自由度佳、良率高等優點,非常適合應用於製造晶片天線。本研究依照此天線製程要求設計了2.4GHz/5GHz ISM頻段微型晶片天線並製作之,其大小為8×5×0.6mm3,並測量此微型晶片天線的反射損失與遠場輻射場型,而所得測量結果與XFDTD程式模擬結果相當吻合,驗證了晶片天線設計分析模型的正確性,且由天線輻射場型可以看出所製作之晶片天線的輻射效率甚佳。
此外,本研究亦將所設計之微型晶片天線應用於無線網路卡產品上,來分析與探討微型晶片天線在實際應用於產品時的使用情形,同時也針對晶片天線的外部封裝材料介電係數、封裝材料厚度、不同淨空區域大小與產品封裝外殼高度等變數進行詳細的模擬與實測,期能對晶片天線特性有更完整的瞭解與掌握。
本研究之晶片天線製程與天線設計技術相當具有應用價值,而多項創新成果已申請中華民國與國外發明專利。
This thesis applies a finite difference time domain simulation software package, XFDTD to design and analyze tiny chip antennas. An Insert Molding Technology is employed to manufacture the chip antennas, where the radiating structure of the antenna is fabricated on a substrate and composite dielectric material is attached by applying the Insert Molding Technology to form the chip antenna. Compared with a more popular Low Temperature Co-firing Ceramic Technology, our approach has the advantages of smaller technology barrier, lower cost, better design flexibility and higher production yield, very suitable for manufacturing the chip antennas. In this study, one 2.4GHz/5GHz ISM band tiny chip antenna with a volume of 8×5×0.6mm3 has been designed and fabricated. Then, return loss and far-field radiation patterns of the chip antenna have been measured. Good agreements between measurements and XFDTD simulations are obtained, which verify the program simulations. Also, the antenna radiation patterns indicate that the efficiency of the chip antenna is very good.
Furthermore, the tiny chip antennas have been applied to WLAN cards to analyze and evaluate how they work in practice. Also, simulations and measurements have been performed to study the effects due to the dielectric constant and the thickness of the molding material, the height of the package and required area on the cards. Thus, the properties of the chip antennas may be understood and handled more comprehensively.
The manufacture and design of the chip antenna developed in this study is quite valuable for practical applications. Patent applications in Taiwan and other countries have therefore been submitted for many new solutions presented here.
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