研究生: |
葉俊儀 Chun-yi Yeh |
---|---|
論文名稱: |
LCD面板冷卻設備之數值模擬 Numerical study on the cooling facility of LCD substrate |
指導教授: |
林顯群
Sheam-chyun Lin |
口試委員: |
陳呈芳
Cheng-fang Chen 莊福盛 Fu-sheng Chuang 洪俊卿 Jin-tsing Hong |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2009 |
畢業學年度: | 97 |
語文別: | 中文 |
論文頁數: | 181 |
中文關鍵詞: | LCD面板 、冷卻 、模擬 |
外文關鍵詞: | CFD, cooling, LCD |
相關次數: | 點閱:199 下載:0 |
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由於目前LCD面板已發展到8.5代廠,LCD面板其尺寸越做越大,新ㄧ代面板廠期望能加快生產速率、降低不良率、與減少成本等訴求。本文研究主題為LCD面板冷卻設備,其主要用於冷卻反覆烘烤後的LCD面板,透過數值模擬來探討箱體內部之流場;針對原型冷卻箱體其內部流場發生速度分佈不均的現象,所造成出風口及尾端抽氣端、LCD面板下方及LCD面板尾端有明顯的迴流產生,吾人針對較明顯之迴流區域設計了一系列之改善方案:加大風機抽氣量與增設擋板等改善參數,利用數值模擬並分析比較改善設計的結果與原始設計之差異性,使吾人瞭解各參數變化對於整體流場之影響,使整體設計更加完善。利用整體流場總改善所得之流量值代入單層LCD面板冷卻模擬,以希望藉此加快LCD面板冷卻速度,最後由熱場改善模擬所得LCD面板溫度為354.5°K僅比原始熱場模擬低了1°,發現吾人所設計的流場改善方式用於LCD面板冷卻所得之效益並沒有想像中來的好。但經由本研究,相信可提供設備廠商在LCD面板冷卻設計開發上,有一套系統化與科學性之分析流程,以達到提升品良率及產量之助益。
To enhance the production efficiency and lower the manufacture cost, the size of LCD glass substrate has been increased significantly as the LCD factory advances to the 8.5 generation. This larger size has made the cooling procedure becoming more difficult. Therefore, designing the cooling facility for the LCD substrate is an essential and challenging task for TFT-LCD industry and thus becomes the topic of this research. The commercial CFD code Fluent is chosen to simulate the flow fields inside a typical cooling module incorporated with boundary conditions based on the practical situation. At first, numerical result reveals that the velocity field is not uniformly distributed along the different rows of LCD plates. Also, several severe reversed flow patterns are identified near the regions of the cooling airstream inlet, the air exhauster opening, and the trailing end and lower zone of LCD glass. Thereafter, based on the above findings, several modifications, such as adjusting the porous ratio, increasing the airflow of exhausters, and adding the appropriate guide plates, are proposed to improve the deficiencies of the original design. Trough a comprehensive simulation work, it is demonstrated that the uniform velocity distribution and the substantial reductions on the reversed and circulated flow patterns are achieved successfully. Nevertheless, a slight cooling effect on LCD substrate is presented from the thermal calculations. In conclusion, this study offers a systematic and rigorous CFD tool for understanding the physical phenomenon inside the LCD cooling facility and proving an important design guideline.
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