研磨加工是一種廣泛用於製程最後之步驟，透過研磨加工來獲得更高的表面品質，或是用於切削高硬度材料，可應用於金屬材料、陶瓷、玻璃及矽基板等。研磨加工主要可以分為兩種加工機制：固定磨粒加工與游離磨粒加工，然而，在選用研磨加工機制時仍未有相關研究明確指出，在相同實驗參數與表面顆粒數目下，固定磨粒加工機制與游離磨粒加工機制兩者對研磨材料造成之影響，及相同的加工條件下要如何有效的選擇加工機制來獲得最佳製程效率。本研究使用環氧樹脂研磨盤，以材料移除量、磨削力比、表面粗糙度及次表面破壞，觀察不同負荷分別延性材料與脆性材料以固定磨粒加工與游離磨粒加工產生之結果與現象。由實驗結果得知，在使用14 μm氧化鋁磨粒進行研磨時，若為追求材料移除量，建議使用游離磨料加工方式進行，但若追求較佳之表面粗糙度，則建議以固定磨粒加工方式進行研磨。固定磨粒研磨時增加負荷可降低表面粗糙度，同時增加材料移除量，但對石英而言有增加次表面破壞之風險。

Abrasive machining is one kind of machining processes which is widely used at the finishing step to obtain higher surface quality, or to machine extremely hard materials. Depending on whether the abrasive particles are bonded on the tool or not, abrasive machining can be classified into two types: bonded abrasive and free abrasive machining processes. Most of studies done of abrasive machining focus on the effects of process parameters and the comparison between the different types of the pad used in the process. However, few research compared these two abrasive machining mechanisms with consistent machining parameters. In this study, the experiments have been conducted with identical parameters to compare these two types of abrasive machining mechanisms. Epoxy resin pad was utilized to machine S45C carbon steel and quartz, which are ductile and brittle materials, respectively. The results of material removal, grinding force ratio, surface roughness, sub-surface damage with different loads are presented in this thesis. The results show that free abrasive machining results in higher material removal rate, and bonded abrasive machining contribute better surface finish.
In addition, bonded abrasive grinding tends to reduce surface roughness and increase the amount of material removal with the increase of normal load. However, there is a risk of sub-surface damage for quartz.

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